Submerged Cooling Fluid Inlet and Pickup Placement
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Solution Overview
Problem
Datacenters and server rooms face overheating issues due to the accumulation of heat from numerous heat-generating devices, which can lead to performance degradation and potential damage, and existing cooling systems may not effectively manage this heat effectively.
Innovation Solution
A cooling system comprising membranes and a connection block with inlet and outlet passages, where coolant fluid flows through apertures to absorb heat from heat-generating devices, utilizing internal support structures and closure structures to create a liquid impermeable seal and direct fluid effectively towards heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If heat-generating devices are densely packed to increase datacenter capacity, then computing and storage resources increase, but heat accumulation increases causing overheating and performance degradation
Solution Approach 1:
The patent employs liquid immersion cooling where dielectric coolant fluid completely surrounds the heat-generating devices, transferring heat more efficiently than air cooling. The coolant circulates through the submerged environment, absorbing heat from multiple devices simultaneously and maintaining lower operating temperatures while allowing higher device density.
Solution Approach 2:
The cooling system utilizes phase change of the coolant fluid to absorb heat. The coolant absorbs thermal energy from heat-generating devices, and through controlled phase transitions (liquid to gas or vice versa), efficiently removes large amounts of heat, enabling higher device packing density without temperature increase.
2Device complexity
If conventional air cooling systems are used, then the system structure is simple, but heat dissipation effectiveness is insufficient for high-density configurations
Solution Approach 1:
The system replaces air cooling with liquid immersion cooling, submerging heat-generating devices in dielectric coolant fluid. This hydraulic approach provides superior heat transfer coefficients compared to air, ensuring reliable heat dissipation even in high-density configurations where thermal management is critical.
Solution Approach 2:
The patent changes the cooling medium from gas (air) to liquid (dielectric coolant), fundamentally altering the heat transfer parameters. The liquid coolant provides higher specific heat capacity and thermal conductivity, dramatically improving heat dissipation effectiveness while managing the increased complexity of liquid handling and sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively absorbs and dissipates heat from heat-generating devices, maintaining them at a safe operating temperature and preventing overheating, thereby ensuring the reliability and performance of data storage and computing resources.
Implementation Method 1
Coolant fluid flows into the first volume via the inlet passage, through the plurality of apertures into the second volume, and exits via the outlet passage
Implementation Method 2
The system effectively absorbs and dissipates heat from heat-generating devices, maintaining them at a safe operating temperature
Data Source
AI summary
In an example, a cooling device is provided. The cooling device includes a connection block including a surface, an inlet passage, and an outlet passage. The cooling device includes a first membrane defining a first volume with a first opening at a first end thereof. The first membrane sealingly engages with the surface around the inlet passage. The cooling device includes a second membrane defining a second volume with a second opening at a second end thereof. The second membrane also defines a plurality of apertures and sealingly engages with the surface inside of the first membrane and around the outlet passage. The cooling device also includes a substrate arranged in the second membrane, is connected to the surface, and includes a heat-generating device. Coolant fluid flows into the first volume via the inlet passage, through the plurality of apertures into the second volume, and exits via the outlet passage.