PCB LED Heat Dissipation via Direct Thermal Path
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Solution Overview
Problem
LCD devices face heat accumulation issues due to LED heat generation, which affects display quality and durability, and existing PCBs with copper thin films, prepreg layers, and metal layers have inefficient heat radiation paths, increasing costs.
Innovation Solution
A PCB design featuring a metal plate with a wiring layer, prepreg layer for insulation, an oxidation prevention layer, and a heat radiation member filled with a thermally conductive material to directly transfer heat from LEDs to the metal plate, bypassing the prepreg layer, and a protrusion portion for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is radiated through the prepreg layer in conventional PCB design, then heat can be dissipated from the LED, but the radiation path becomes long and costs increase due to requiring high thermal conductivity prepreg layers
Solution Approach 1:
The patent segments the heat radiation path by introducing a through-hole that creates a direct thermal conduction channel from the LED through the oxidation prevention layer and wiring layer to the heat radiation member, bypassing the prepreg layer. This segmentation allows heat to travel through a dedicated high-conductivity path while the prepreg layer maintains its insulating function for other purposes.
Solution Approach 2:
The patent introduces a heat radiation member as an intermediary component that directly contacts the LED through the through-hole. This intermediary provides a high thermal conductivity pathway that mediates heat transfer from the LED to the external environment, eliminating the need for expensive high-thermal-conductivity prepreg layers while improving overall heat dissipation efficiency.
2Temperature
If high thermal conductivity prepreg layers are used to improve heat radiation, then heat dissipation improves, but manufacturing costs increase
Solution Approach 1:
The patent extracts the heat radiation function from the prepreg layer by creating a separate through-hole pathway. Instead of relying on the prepreg layer to conduct heat (which would require expensive high-thermal-conductivity materials), the heat conduction function is extracted and assigned to a dedicated heat radiation member that contacts the LED directly through the through-hole, allowing the use of standard, lower-cost prepreg layers.
Solution Approach 2:
The patent replaces expensive high-thermal-conductivity prepreg layers with a more cost-effective solution using standard prepreg layers combined with a separate heat radiation member. This substitution uses cheaper materials while achieving the same or better heat dissipation performance through the dedicated thermal pathway.
3Illumination intensity
If LEDs are mounted on conventional PCBs, then light emission is achieved, but heat accumulation occurs at the LED junction reducing lifespan
Solution Approach 1:
The patent adds a vertical dimension to heat dissipation by creating a through-hole that extends from the top surface to the bottom surface of the PCB. This three-dimensional heat conduction pathway allows heat to escape directly from the LED junction through the oxidation prevention layer and wiring layer to the heat radiation member on the opposite side, providing efficient heat removal that preserves LED lifespan while maintaining light emission function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the heat radiation path, enhances heat dissipation, lowers the temperature at the LED junction, increases the lifespan of LEDs, and reduces manufacturing costs by eliminating the need for high thermal conductivity prepreg layers.
Implementation Method 1
a heat radiation member formed from a heat radiation material which is filled in a hole passing through the oxidation prevention layer, the wiring layer, and the prepreg layer
Data Source
AI summary
A PCB and an LCD device with the same are disclosed. The PCB and the LCD device force an LED to directly contact either a heat radiation member or a metal plate. As such, heat generated in the LED is directly transferred to the heat radiation member or the metal plate without passing through wiring and prepreg layers. Therefore, the heat is effectively discharged to the exterior through a bottom cover. In other words, heat generated in the LED can be effectively discharged because of passing through the shortened heat radiation path.