Prepreg Adhesion via Silane Treatment and PPE Modification
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Solution Overview
Problem
Conventional thermosetting resins used in circuit boards, such as phenol and epoxy resins, exhibit insufficient dielectric properties at high frequencies, and polyphenyleneether, while promising, faces challenges with adhesion to glass cloth due to few functional groups with high polarity, leading to decreased adhesive properties and a growing need for low dielectric substrates with improved adhesiveness.
Innovation Solution
A prepreg is developed using glass cloth treated with silane coupling agents and a thermosetting resin composition containing polyphenyleneether modified with ethylenically unsaturated compounds, along with cyanurate compounds and organic peroxides, to achieve a low dielectric constant and loss tangent while enhancing adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenyleneether is used as a thermosetting resin to reduce dielectric constant and dielectric loss tangent, then dielectric properties are improved, but adhesive properties between glass cloth and resin-cured layer decrease
Solution Approach 1:
A silane coupling agent treatment layer is applied to the glass cloth surface to act as an intermediary between the glass cloth and polyphenyleneether resin. This coupling layer provides both adhesion to the glass cloth and compatibility with the low-polarity polyphenyleneether resin, resolving the adhesion problem while maintaining dielectric properties.
Solution Approach 2:
The polyphenyleneether resin is modified by incorporating functional groups or additives that enhance adhesion to the silane-treated glass cloth surface. This parameter change allows the resin to maintain its low dielectric properties while improving adhesive strength through chemical or physical interactions with the coupling layer.
2Strength
If conventional thermosetting resins (phenol, epoxy, polyimide) are used, then adhesive properties are maintained, but dielectric properties in high-frequency range are insufficient
Solution Approach 1:
The invention creates a composite structure consisting of glass cloth, silane coupling agent treatment layer, and polyphenyleneether resin. This composite approach combines the low dielectric properties of polyphenyleneether with the adhesion benefits of silane coupling, achieving both requirements that cannot be met by conventional resins alone.
3Strength
If glass cloth is treated with silane coupling agents to improve adhesion, then adhesive properties are enhanced, but dielectric constant and dielectric loss tangent increase
Solution Approach 1:
The type and concentration of silane coupling agents are optimized to achieve sufficient adhesion while minimizing impact on dielectric properties. The treatment parameters (amount, method, curing conditions) are controlled to maintain low dielectric constant and loss tangent while providing adequate adhesive strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in materials with improved adhesiveness and reduced dielectric constants and loss tangents, facilitating the manufacture of high-frequency wiring boards with enhanced heat resistance and adhesive strength.
Implementation Method 1
it is also known that a silane coupling agent adsorption layer is formed on a glass cloth surface
Implementation Method 2
the thermosetting resin composition contains polyphenyleneether having a terminal hydroxyl group modified with an ethylenically unsaturated compound
Data Source
AI summary
Provided are: a prepreg with low dielectric constant, low dielectric loss tangent, and improved adhesiveness to glass cloth; and a laminate for a circuit board. The prepreg is formed of the glass cloth serving as a base material and a semi-cured product of a thermosetting resin composition impregnated into the glass cloth, where the glass cloth comprises a treated surface treated by at least one type of silane coupling agent selected from methacryl-based silane coupling agents, acryl-based silane coupling agents, and isocyanate-based silane coupling agents, and the thermosetting resin composition contains polyphenyleneether having a terminal hydroxyl group modified with an ethylenically unsaturated compound in a main chain of the polyphenyleneether. The laminate for the circuit board is obtained by laminating the prepreg and a conductor layer.