Vinyl-Modified Polyphenylene Ether Resin Composition for High-Frequency Circuit Substrates
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Solution Overview
Problem
Current polyphenylene ether resin compositions for high-frequency circuit substrates face challenges in achieving low dielectric constant, low dielectric loss, high heat resistance, and sufficient interlayer adhesive force while avoiding issues like volatilization during processing, particularly when using linear or cyclic organosilicon compounds as crosslinking agents.
Innovation Solution
A polyphenylene ether resin composition incorporating a vinyl-modified polyphenylene ether resin combined with an organosilicon resin having a three-dimensional network structure, formed by hydrolytic condensation of specific siloxane units, which acts as a crosslinking agent to provide high crosslinking density, heat resistance, and improved mechanical properties without volatilization issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If linear organosilicon compound containing unsaturated double bonds is used as crosslinking agent, then flexibility is improved, but bending strength deteriorates
Solution Approach 1:
The patent uses a composite crosslinking system combining both linear and cyclic organosilicon compounds containing unsaturated double bonds. The linear compound (5-50 wt%) provides flexibility and processability, while the cyclic compound (45-95 wt%) contributes to high bending strength and structural integrity. This composite approach resolves the contradiction by synergistically combining the advantages of both molecular structures.
2Reliability
If cyclic organosilicon compound containing unsaturated double bonds is used as crosslinking agent, then overall properties are improved, but volatilization occurs during sizing and baking process
Solution Approach 1:
The patent modifies the molecular weight parameter of the cyclic organosilicon compound by selecting compounds with molecular weights of 500-2000, which reduces volatilization during processing while maintaining the desired crosslinking performance. Additionally, the patent controls the ratio of cyclic to linear compounds and adjusts curing parameters to minimize volatilization while achieving complete crosslinking.
3Temperature
If vinyl group is introduced to polyphenylene ether to make it thermosetting, then heat resistance and interlayer adhesive force are improved, but processing complexity increases
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary that facilitates the crosslinking reaction between vinyl-modified polyphenylene ether and organosilicon compounds. The silane coupling agent contains both vinyl groups for reacting with polyphenylene ether and siloxane groups for forming crosslinked networks, thereby simplifying the processing while achieving high heat resistance and interlayer adhesive force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high glass transition temperature, low water absorption, low dielectric constant, low dielectric loss, and high interlayer adhesive force, enhancing the reliability and performance of high-frequency circuit substrates with improved bending strength and thermal stability.
Implementation Method 1
formed by hydrolytic condensation of monofunctional siloxane unit (M unit) and trifunctional siloxane unit (T unit)
Implementation Method 2
acts as a crosslinking agent to provide high crosslinking density, heat resistance
Data Source
AI summary
The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has the advantages of a low dielectric constant, a low dielectric loss, high heat resistance, low water absorption, a high interlayer adhesive force and a high bending strength, and is very suitable as a circuit substrate of high-speed electronic equipment.