Resin Composition for High-Frequency PCBs
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Solution Overview
Problem
Current materials for high-frequency printed circuit boards struggle to achieve both high glass transition temperature and low dissipation factor, which are essential for excellent electrical properties and compatibility with 5G communication frequencies.
Innovation Solution
A resin composition comprising 30 wt % to 60 wt % bismaleimide resin, 1 wt % to 10 wt % liquid rubber resin, and 20 wt % to 50 wt % filler, which is specifically designed to enhance heat resistance and reduce the dissipation factor of high-frequency substrate materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid rubber is added to reduce dissipation factor, then dissipation factor decreases, but glass transition temperature decreases
Solution Approach 1:
The patent optimizes the content ratio of liquid rubber in the resin composition to achieve the desired balance between dissipation factor and glass transition temperature. By controlling the amount of liquid rubber added, the formulation achieves low dissipation factor while maintaining adequate glass transition temperature through parameter optimization.
Solution Approach 2:
The patent creates a composite resin composition combining multiple materials (bismaleimide resin, liquid rubber, and filler) to achieve properties that individual materials cannot provide alone. This composite approach allows simultaneous optimization of both dissipation factor and glass transition temperature through synergistic material interaction.
2Temperature
If bismaleimide resin content is increased to raise glass transition temperature, then glass transition temperature increases, but dissipation factor increases
Solution Approach 1:
The patent optimizes the content ratio of bismaleimide resin to achieve the desired balance between glass transition temperature and dissipation factor. By controlling the amount of bismaleimide resin in the formulation, the patent achieves high glass transition temperature while maintaining low dissipation factor through parameter optimization.
Solution Approach 2:
The patent creates a composite resin composition combining multiple materials (bismaleimide resin, liquid rubber, and filler) to achieve properties that individual materials cannot provide alone. This composite approach allows simultaneous optimization of both glass transition temperature and dissipation factor through synergistic material interaction.
3Quantity of substance
If filler content is increased to reduce dielectric constant, then dielectric constant decreases, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the content ratio of filler to achieve the desired balance between dielectric constant and manufacturing complexity. By controlling the amount of filler added, the formulation achieves low dielectric constant while maintaining manufacturing feasibility through parameter optimization.
Solution Approach 2:
The patent creates a composite resin composition combining multiple materials (bismaleimide resin, liquid rubber, and filler) to achieve properties that individual materials cannot provide alone. This composite approach allows simultaneous optimization of dielectric constant and manufacturing complexity through synergistic material interaction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a glass transition temperature greater than or equal to 250° C., a dissipation factor less than or equal to 0.002, and a dielectric constant less than or equal to 3.2, thereby meeting the electrical property requirements for high-frequency printed circuit boards.
Implementation Method 1
a bismaleimide resin; 1 wt % to 10 wt % of a liquid rubber resin
Implementation Method 2
the resin composition achieves a glass transition temperature greater than or equal to 250° C.
Implementation Method 3
the resin composition of the disclosure has a non-polar backbone structure, so it is not easily polarized in an electric field, thereby significantly reducing the dielectric constant
Implementation Method 4
the resin composition further includes 0.1 wt % to 3 wt % of a coupling agent
Implementation Method 5
the resin composition further includes 0.1 wt % to 2 wt % of a catalyst
Implementation Method 6
the resin composition further includes 10 wt % to 20 wt % of a flame resisting agent
Data Source
AI summary
The disclosure provides a resin composition, which includes 30 wt % to 60 wt % of a bismaleimide resin; 1 wt % to 10 wt % of a liquid rubber resin; and 20 wt % to 50 wt % of a filler, based on a total weight of the resin composition.