Resin Composition Volatility Reduction for High-Speed PCBs
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Solution Overview
Problem
Existing resin materials for copper-clad laminates, such as those using phenylvinylsilane, suffer from high volatility during heating processes, leading to waste of expensive raw materials and degradation of laminate properties, which fail to meet performance requirements for high-speed data transmission.
Innovation Solution
A resin composition comprising 100 parts by weight of a copolymer of phenylvinylsilane and an alkenyl compound, along with 20 to 100 parts by weight of a vinylbenzyl-terminated phenolic resin, is developed to reduce volatility and enhance the performance of copper-clad laminate materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If phenylvinylsilane is used directly as resin material, then the resin composition can be simple and easy to manufacture, but the volatility during heating process increases significantly causing material waste and property degradation
Solution Approach 1:
The patent creates a composite resin system by copolymerizing phenylvinylsilane with alkenyl compounds (such as vinylbenzyl-terminated phenolic resin). This composite approach combines the beneficial properties of both components: phenylvinylsilane provides low dielectric constant and good adhesion, while alkenyl compounds reduce volatility and improve thermal stability. The synergistic effect resolves the contradiction between ease of manufacture and material loss during processing.
Solution Approach 2:
The patent modifies the chemical structure parameters of the resin system by introducing alkenyl compound units into the polymer chain. This structural parameter change reduces the volatility of phenylvinylsilane during heating while maintaining its essential properties. The copolymer composition ratio is optimized to balance manufacturing simplicity with reduced material loss.
2Ease of manufacture
If phenylvinylsilane is used directly, then the resin composition remains simple, but the glass transition temperature and thermal resistance fail to meet performance requirements for high-speed data transmission
Solution Approach 1:
The patent employs composite materials by combining phenylvinylsilane with alkenyl compounds to achieve the required glass transition temperature and thermal resistance for high-speed data transmission applications. The composite structure provides both the simplicity of formulation and the enhanced performance characteristics needed for reliable operation.
Solution Approach 2:
The patent changes the molecular structure parameters through copolymerization, introducing rigid alkenyl compound units that increase glass transition temperature and improve thermal resistance. These parameter changes enable the resin to meet stringent performance requirements while maintaining ease of manufacture through a straightforward copolymerization process.
3Ease of manufacture
If phenylvinylsilane is used directly, then the formulation is simple, but copper foil peeling strength and dielectric properties deteriorate during heating process
Solution Approach 1:
The patent uses composite materials where alkenyl compounds enhance copper foil adhesion and dielectric properties while phenylvinylsilane maintains formulation simplicity. The synergistic interaction between components ensures strong copper foil peeling strength even after high-temperature processing, resolving the contradiction between simple formulation and strength maintenance.
Data Source
AI summary
A resin composition is disclosed, comprising 100 parts by weight of a copolymer of phenylvinylsilane and alkenyl compound and 20 parts by weight to 100 parts by weight of a vinylbenzyl-terminated phenolic resin; wherein the raw material of the copolymer of phenylvinylsilane and alkenyl compound comprises a phenylvinylsilane and an alkenyl compound, based on a total weight of the phenylvinylsilane and the alkenyl compound being 100 parts by weight, the phenylvinylsilane is 80 parts by weight to 98 parts by weight, and the alkenyl compound is 2 parts by weight to 20 parts by weight. The resin composition can be made into a product such as a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator.