Resin Composition for High-Tg PCB Laminates
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Solution Overview
Problem
Existing copper-clad laminates and resin compositions used in their preparation do not fully meet the advanced requirements of printed circuit board (PCB) packaging technology, particularly in terms of higher glass transition temperature, lower thermal expansion, reduced reflow warpage, and improved signal integrity.
Innovation Solution
A resin composition comprising 100 parts by weight of a copolymer with a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), where the content of the structural unit formed by the monomer of Formula (2) is 55 wt % to 90 wt %, and 1 part by weight to 15 parts by weight of a compound of Formula (3), which includes unsaturated C═C double bond-containing groups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional resin compositions are used for copper-clad laminates, then general characteristics are maintained, but glass transition temperature is insufficient and thermal expansion is high
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin by incorporating specific copolymers with controlled monomer ratios (Formula 1 and Formula 2 monomers in 95:5 to 55:45 weight ratio ranges) and adding compounds with unsaturated bonds (Formula 3). This chemical parameter change directly increases the glass transition temperature from conventional levels to ≥290°C while reducing thermal expansion coefficients to meet advanced PCB requirements.
Solution Approach 2:
The invention creates a composite resin system by combining multiple components: copolymer (Formula 1 + Formula 2), compound with unsaturated bonds (Formula 3), and optionally crosslinking agents. This composite material approach synergistically improves both glass transition temperature and thermal expansion properties, achieving performance that neither component could achieve alone for advanced high-frequency PCB applications.
2Reliability
If existing copper-clad laminates are used, then basic interconnection and insulation functions are provided, but reflow warpage magnitude is large and signal integrity is compromised
Solution Approach 1:
The patent changes the physical and chemical parameters of the laminate by using the specialized resin composition with controlled copolymer ratios and unsaturated bond compounds. This results in reduced coefficient of thermal expansion (CTE) and improved dimensional stability, reducing reflow warpage to ≤15μm and maintaining signal integrity for high-frequency applications.
3Strength
If conventional resin compositions are used, then manufacturing process is simple, but storage modulus decay rate is high and laminate appearance is poor
Solution Approach 1:
The invention optimizes the compositional parameters within specific ranges to balance performance and manufacturability. The copolymer ratio (Formula 1:Formula 2 monomers), compound content (Formula 3 at 1-15 parts by weight per 100 parts copolymer), and optional crosslinking agent amounts are all controlled within defined ranges. This parameter optimization maintains storage modulus with decay rate ≤20% while keeping the manufacturing process relatively simple and laminate appearance quality high.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a glass transition temperature of greater than or equal to 290° C, a storage modulus decay rate of less than or equal to 16%, a reflow warpage magnitude of less than or equal to 14 μm, a percent of thermal expansion in Z-axis of less than or equal to 1.2%, and a dissipation factor of less than or equal to 0.00086, thereby addressing the limitations of existing materials for advanced PCB applications.
Implementation Method 1
a copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2)... a compound of Formula (3), each X′, Y′ and Z′ independently represent a hydrogen atom, a C1 to C4 alkyl group, a phenyl group, or an unsaturated C═C double bond-containing group
Data Source
AI summary
A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (B) 1 part by weight to 15 parts by weight of a compound of Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, storage modulus decay rate, reflow warpage magnitude, percent of thermal expansion in Z-axis, dissipation factor and laminate appearance.