Thermosetting Resin Composition for Visual Curing State Detection
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Solution Overview
Problem
Current thermosetting resin compositions for filling through-holes in printed wiring boards face challenges in visually distinguishing between semi-cured and fully cured states, which complicates surface polishing and affects productivity.
Innovation Solution
A thermosetting resin composition comprising a thermosetting resin, a curing agent, and a filler, where specific L* values measured using the L*a*b* color system before and after curing satisfy certain criteria, allowing for visual differentiation between semi-cured and fully cured states, and includes a preferred epoxy resin, imidazole as a curing agent, and a filler content that enhances heat resistance and polishability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resin composition is used for filling through-holes in printed wiring boards, then mounting reliability is improved, but visual distinction between semi-cured and fully cured states becomes difficult
Solution Approach 1:
The patent introduces a coloring agent into the thermosetting resin composition that causes color changes during the curing process. The coloring agent is selected based on specific color change characteristics that enable visual distinction between semi-cured and fully cured states. This allows operators to monitor the curing progress and adjust polishing conditions accordingly, while maintaining the reliability benefits of thermosetting resin for hole filling.
2Shape
If surface polishing is performed after curing, then surface flatness is improved, but polishing conditions cannot be adjusted without visual distinction of cured state
Solution Approach 1:
The coloring agent provides visual feedback about the curing state of the thermosetting resin composition. By observing color changes, operators can determine when the resin is semi-cured versus fully cured, which enables them to adjust polishing conditions appropriately. This feedback mechanism ensures that surface polishing can be performed effectively with proper adjustment of polishing parameters based on the actual cured state.
3Stability of the object's composition
If curing shrinkage occurs during hole filling, then material contraction is inevitable, but large recesses are created requiring additional surface polishing
Solution Approach 1:
The patent applies a filler material to the inner wall of the through-hole before filling with the thermosetting resin composition. This preliminary action creates a buffer that compensates for the curing shrinkage that will occur during the curing process. The filler material is selected to have appropriate thermal expansion characteristics that counterbalance the shrinkage, thereby minimizing the formation of large recesses and reducing the need for extensive surface polishing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables clear visual distinction between semi-cured and fully cured states, facilitating adjusted polishing conditions and improving productivity in the manufacturing process of printed wiring boards.
Implementation Method 1
a semi-cured product obtained by thermally curing the thermosetting resin composition at 80° C. for 60 minutes
Implementation Method 2
a fully cured product obtained by further thermally curing the semi-cured product at 150° C. for 60 minutes
Implementation Method 3
an L* value measured using an L*a*b* color system before curing the thermosetting resin composition is defined as L1
Data Source
AI summary
Provided is a thermosetting resin composition whose semi-cured state and fully cured state can be visually distinguished.The thermosetting resin composition according to the invention is a thermosetting resin composition including a thermosetting resin, a curing agent, and a filler, in which whenan L* value measured using an L*a*b* color system before curing the thermosetting resin composition is defined as L1,an L* value measured using the L*a*b* color system for a semi-cured product obtained by thermally curing the thermosetting resin composition at 80° C. for 60 minutes is defined as L2, andan L* value measured using the L*a*b* color system for a fully cured product obtained by further thermally curing the semi-cured product at 150° C. for 60 minutes is defined as L3,the thermosetting resin composition satisfies the following Formula 1:(L2-L3)/(L1-L3)≥ 0.7.(Formula 1)