Fluorescent Composite Resin LED Substrate
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Solution Overview
Problem
Conventional LED technologies, such as COB and COG, face limitations in light flux, heat dissipation, manufacturing yield and speed, and color temperature consistency due to their substrates, with COG being prone to breakage and having poor heat dissipation compared to other substrates.
Innovation Solution
A fluorescent composite resin substrate with a mixture of curable composite resin, glass filler, and fluorescent material, which includes silicone resin, glass powder, and a hardening agent, allowing for light emission through six planes, improved heat dissipation, and increased manufacturing efficiency and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a glass substrate is used in COG technology to enable light emission through six planes, then light flux is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent uses a composite resin substrate containing glass powder particles dispersed in a resin matrix, combining the light-emitting properties of glass with the heat dissipation capabilities of thermally conductive resin materials. This composite structure allows light to pass through six planes while the resin component provides effective heat dissipation pathways.
Solution Approach 2:
The patent modifies the substrate material parameters by incorporating specific glass powder particle sizes, concentrations, and thermal conductivity values into the resin matrix. By adjusting these parameters, the substrate achieves optimal balance between light transmission efficiency and heat dissipation performance.
2Illumination intensity
If a glass substrate is used in COG technology, then light emission through six planes is achieved, but manufacturing yield rate deteriorates due to breakage
Solution Approach 1:
The patent replaces rigid glass substrates with a flexible resin-based composite substrate that can withstand manufacturing processes without breaking. The resin matrix provides flexibility and impact resistance, eliminating the fragility issues of pure glass substrates while maintaining light transmission properties.
Solution Approach 2:
The resin composite substrate is easier and cheaper to manufacture than glass substrates, allowing for higher yield rates and faster production speeds. Even if defects occur, the lower material cost and easier replacement simplify manufacturing processes.
3Illumination intensity
If a glass substrate is used in COG technology, then light emission through six planes is achieved, but manufacturing speed deteriorates
Solution Approach 1:
The patent changes the substrate material from glass to resin composite, which can be manufactured using faster injection molding or casting processes. The resin material allows for quicker production cycles and higher manufacturing throughput while maintaining the required optical properties for six-plane light emission.
4Device complexity
If fluorescent powder is placed only in package adhesive rather than substrate, then manufacturing simplicity is maintained, but color temperature consistency deteriorates
Solution Approach 1:
The patent distributes fluorescent powder throughout the resin substrate matrix rather than concentrating it only in the package adhesive. This creates local fluorescence conversion zones throughout the substrate, ensuring uniform color temperature across the entire LED surface from all six emission planes.
Solution Approach 2:
The resin substrate serves multiple functions: it provides structural support, enables heat dissipation, transmits light, and contains fluorescent powder for wavelength conversion. This multi-functionality eliminates color temperature inconsistencies while maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light flux, eliminates color temperature discrepancies, and improves heat dissipation and manufacturing efficiency, offering a more robust and resilient substrate that surpasses the limitations of COB and COG technologies.
Implementation Method 1
a fluorescent composite resin substrate 1, two conductive brackets 2, a light emitting unit 3, two conductive lines 4 and a package material 5. The fluorescent composite resin substrate 1 is formed from a mixture through a curing reaction. The mixture forming the fluorescent composite resin substrate includes a curable composite resin, a hardening agent and a fluorescent material.
Data Source
Figure 1
Figure 2~2A
Figure 3
AI summary
A fluorescent composite resin substrate white light LED includes a fluorescent composite resin substrate, two conductive brackets, a light emitting unit, two conductive lines and a package material. The fluorescent composite resin substrate is formed from a mixture through a curing reaction. Each of the conductive brackets is partially connected to the substrate. The light emitting unit is disposed on the substrate. The conductive lines are connected to the light emitting unit and respectively connected to the conductive brackets. The package material is formed from a mixture through a curing reaction. By fixing the light emitting unit at the fluorescent composite resin substrate, when applied to white light LED operations, the present invention achieves effects of emitting light through six planes, having high light flux and good heat dissipation, and significantly increasing production yield rate and speed without incurring different color temperatures at front and reverse sides.