Active Interposer Power Management for Programmable Logic

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Solution Overview

Problem

Multi-dimensional programmable logic devices face challenges with unpredictable bandwidth usage and power management due to shared power supplies, leading to performance degradation and uneven heating, especially when using voltage identification bit control schemes.

Innovation Solution

Incorporating an active interposer with embedded temperature sensors and a fully integrated voltage regulator to mitigate noise in the power distribution network, generate artificial currents, and perform dynamic voltage and frequency scaling, while using redundant couplings for improved thermal management and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If voltage identification bit control schemes are used for power management, then operational bin control is achieved, but noise in the power distribution network increases and performance degrades

Engineering Contradiction:

Improveoperational bin controlVSAvoidnoise in power distribution network

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an active interposer as an intermediary component between the programmable logic device and the power distribution network. This interposer includes embedded temperature sensors and a fully integrated voltage regulator that actively mitigates noise in the power distribution network, thereby resolving the contradiction between achieving operational bin control and reducing noise-induced performance degradation

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements feedback mechanisms through embedded temperature sensors that monitor thermal conditions and provide real-time data to the voltage regulator. This feedback loop enables dynamic adjustment of power distribution to maintain optimal operation while minimizing noise, thus resolving the contradiction between operational adaptability and noise reduction

Inventive Principle:

Principle #23Feedback

2Device complexity

If shared power supplies are used across multi-dimensional programmable logic devices, then device complexity is reduced, but uneven heating and thermal management issues occur

Engineering Contradiction:

Improvepower supply structureVSAvoidthermal uniformity

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent segments the power distribution system by incorporating a fully integrated voltage regulator within the active interposer that can independently control power delivery to different regions of the programmable logic device. This segmentation enables localized thermal management while maintaining an otherwise simple shared power supply architecture

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent dynamically changes power distribution parameters through the voltage regulator based on real-time thermal feedback from embedded sensors. This allows the system to maintain simple hardware architecture while achieving thermal uniformity through dynamic parameter adjustment

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If functional versatility is increased in programmable logic devices, then adaptability improves, but unpredictable bandwidth usage and current changes increase

Engineering Contradiction:

Improvefunctional versatilityVSAvoidbandwidth usage and current changes

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent implements dynamic power management through the fully integrated voltage regulator that continuously adjusts power delivery based on actual usage patterns. This dynamic approach allows the system to support high functional versatility while efficiently managing energy consumption and reducing unpredictable current changes

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS11444624B2Power management for multi-dimensional programmable logic devices

Publication Date: 2022.09.13 ALTERA CORP

AI summary

A device may include a fabric die coupled to an active interposer. The fabric die may include programmable logic fabric and configuration memory that programs the programmable logic fabric. The programmable logic fabric of the fabric die may access at least a portion of the active interposer to perform an operation. As discussed herein, different power management techniques associated with the active interposer may be used to improve operation of the device.