Active Matrix Substrate Terminal Region Insulating Layer Design

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Solution Overview

Problem

Conventional liquid crystal display apparatuses suffer from line exfoliation and cutting defects in the terminal region due to gaps and uneven surfaces, which are difficult to suppress with existing protection films and adhesion methods.

Innovation Solution

An active matrix substrate with an insulating layer that contacts the edge face of lines in the terminal region, preventing exfoliation and cutting by filling concavities and convexities, and maintaining contact with the line even at inverse tapered shapes, thereby enhancing adhesion and reducing stress-induced defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If protection films are formed on lines in the terminal region, then adhesion is improved, but line exfoliation and cutting defects still occur due to gaps and uneven surfaces

Engineering Contradiction:
ImproveadhesionVSAvoidline exfoliation and cutting defects
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The insulating layer is selectively formed to contact the edge faces of lines in the terminal region where exfoliation and cutting defects occur, while maintaining different structures in pixel regions. This localized approach addresses the specific problem areas without unnecessarily complicating the entire device structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

An insulating layer is introduced as an intermediary substance between the lines and the external environment in the terminal region. This layer fills concavities and convexities on line surfaces, creating a smooth interface that prevents protection films from peeling off and eliminates gaps that cause exfoliation and cutting defects.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conventional protection films are applied to lines, then adhesion is enhanced, but cutting of layers stacked on lines occurs due to stress concentration at gaps

Engineering Contradiction:
ImproveadhesionVSAvoidlayer integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The insulating layer is specifically formed in the terminal region where lines are exposed and prone to defects, while pixel regions maintain their conventional structure. This localized application prevents layer cutting at critical stress points without affecting the overall device architecture.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The insulating layer is formed beforehand to fill concavities and convexities on line surfaces before subsequent protection films or layers are applied. This pre-preparation creates a smooth, stress-distributing interface that prevents future peeling and cutting defects when other layers are stacked on the lines.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If the insulating layer is formed to contact the edge face of lines, then exfoliation is suppressed, but manufacturing complexity increases

Engineering Contradiction:
Improveexfoliation suppressionVSAvoidinsulating layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The insulating layer structure is implemented only in the terminal region where lines are exposed and exfoliation occurs, while pixel regions maintain conventional insulating layer configurations. This selective approach suppresses exfoliation at problem areas without unnecessarily complicating the entire device structure.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS8711296B2Active matrix substrate, method for manufacturing same, and liquid crystal display apparatus
Publication Date: 2014.04.29 SHARP KK
  • US8711296B2 patent drawing
  • US8711296B2 patent drawing
  • US8711296B2 patent drawing

AI summary

An active matrix substrate (30) of the present invention includes a substrate, a gate line (50) formed on the substrate, and an interlayer insulating layer (90) for insulating a layer formed on the gate line (50) from the gate line (50). In a region of the substrate, the interlayer insulating layer (90) is not provided on an upper surface of the gate line (50), and therefore, the upper surface is exposed. On the other hand, the insulating layer (90) is provided on the substrate so as to have contact with at least an edge face of the gate line (50) which edge face is on an extension of a longitudinal direction of the gate line (50).