Solid-State Devices TRIZ Cases

Nest gate driving lines inside the peripheral sealant structure to protect signal transmission paths from scratches and corrosion.

Non-orthogonal adhesive lines reduce creep deformation in flexible display devices while maintaining structural integrity.

Direct adhesion of a curved display panel to a lens member eliminates support structures, reducing head-mounted display weight and size.

Reducing photo spacer distribution density in sensor light-receiving areas improves light transmittance and optical sensor performance.

Segmented insulating layer heights support uniform spacers, resolving manufacturing complexity and improving aperture ratio.

An adjustable operating surface equation dynamically tunes integrated circuit voltage to reduce static power consumption caused by manufacturing variations.

Surface-treated carrier plates allow easy separation of glass-filler reinforced plastic substrates, eliminating laser release costs and adhesive contamination.

Silicone reflective layers redirect scattered photons to increase brightness while resisting blue-light yellowing that degrades epoxy.

A polyolefin polarization film uses high storage modulus adhesives to bond phase delay layers.

Overcoating layer with convex portions refracts light emitted from the organic light emitting layer to enhance external emission efficiency.

A reflective layer containing thermosetting resin and filler shields blue light, preventing adhesive degradation while maintaining strength.

A method deposits insulators on specific electrode zones to separate conductive layers while preserving sensitive structures.

An organometallic cathode layer enhances electron injection efficiency in organic light-emitting devices.

Segmenting the mask into photoresist and hard layers prevents ion bombardment damage to polycrystalline silicon gates, maintaining charge storage reliability.

An organic thin film incorporates nanosized particles into a polymer backbone to generate multiple emission spectra maxima for white light.

Selective removal of a nitride film prevents impurity diffusion around memory cells, resolving the contradiction between device capacity and operation accuracy.

An organic functional ink composition uses terpenes to optimize viscosity and surface tension for uniform layer formation.

A display apparatus uses insulating layers with distinct opening sizes to protect conductive electrodes from environmental damage.

A display substrate incorporates a heat dissipation layer between the base and elements to manage thermal energy.

A transparent plate mediates laser transmission while a jet nozzle directs liquid flow to remove debris and prevent bubble obstruction.

An optical auxiliary layer with low refractive index and high absorption coefficient enhances light extraction efficiency in organic light-emitting devices.

Etching a trench through dielectric layers to expose the silicon substrate minimizes uncontrolled reflections and improves light absorption uniformity.

An optical module uses substrate alignment marks visible through connector guide-pin holes for active fiber positioning.

A conductive blocking structure laterally extends within a hybrid bonding interface to shield stacked image sensors from radiation.

Lateral light-guiding members redirect sideways emission upward, resolving reduced luminance from inefficient light guidance.

Inclined reflective layers create schottky contacts that spread current evenly, resolving poor extraction in light emitting devices.

An undoped moat and curved junction in a high-voltage diode finFET widen the depletion region to prevent through-substrate leakage.

Segmenting the light-blocking member prevents laser scattering damage during defective pixel repair, preserving normal pixel integrity.

An insulating layer contacts gate line edge faces in the terminal region to fill surface concavities and convexities.

A protection layer blocks laser irradiation from reaching circuitry on the receiving substrate, preventing damage during micro-LED transfer.

A dummy gate electrode fills step difference portions between memory cell and peripheral regions, preventing irregular reflection during photolithography.

Segmented charge trap layers with optimized silicon oxide stoichiometry resolve afterimage retention and luminance stability bottlenecks in display devices.

Vertical stacking of orthogonal conductive lines reduces fabrication complexity while increasing memory density through segmented trench formation.

Novel aminofluorene carbazole copolymer enhances thermal stability and hole transport.

Grooves and support portions join transmissive and auxiliary electrodes, reducing lateral resistance and fixing IR-drop defects in top-emitting OLED displays.

Silane ink deposition integrates diodes and transistors into single-substrate RFID tags, reducing parasitic capacitance to improve electrical characteristics.

Through-hole electrodes in a sub-mount eliminate wire bonding, improving heat dissipation and light uniformity.

Epitaxial regrowth passivates etched LED mesa facets, reducing surface recombination velocity and non-radiative losses in miniaturized devices.

Reflective particles in the sealant scatter totally reflected light, breaking waveguide modes to boost OLED extraction efficiency.

A sensor-carrying medium integrates MEMS sensors with a wireless power generator to enable real-time environmental monitoring.

A nonvolatile memory device applies specific voltage levels to control gates and wirings for selective hole injection into charge retention layers.

A white subpixel and basic color subpixels synthesize light through layered or mixed materials to enhance image brightness and color.

Alternating optical sensors allow adjacent light paths to detect LED illuminance loss, resolving ambiguity between ink obstruction and component failure.

Magnetic field alignment positions lyophilic nanoparticles at the layer base, resolving contamination versus uniformity trade-offs.

Laser irradiation forms conductive pathways through organic layers to resolve resistance-induced light emission inhomogeneity in large-area displays.

Color filters overlap pixel light-emitting layers to define sub-pixel colors, resolving fine metal mask precision limits and reducing color crosstalk.

Forming connection electrodes after anode etching prevents undercutting, ensuring accurate lighting inspection.

Asymmetric sub-pixel shapes in the pixel-defining layer minimize external light reflection and remove light blur in vehicle displays.

A scatter layer with variable particle concentration redirects radiation from active regions to edge areas, resolving non-uniform luminous density.

Segmented gates and virtual reference potentials control threshold voltages independently, reducing leakage currents in nonvolatile memory cells.

Merging source and drain electrodes into one patterned layer reduces mask counts and light-blocking layers, improving luminance uniformity.

Laser ablation releases micro-LED chips from carriers while composite resin absorbs impact, resolving precision-speed trade-offs in high-yield mounting.

A polyimide coating protects solar panels using oligomeric silsesquioxane to form a self-healing silica layer.

An emitter eave structure enables self-aligned base electrode formation, lowering base resistance and parasitic capacitance for high-frequency operation.

Particle-induced nucleation creates a crystalline organic layer that boosts luminescence while avoiding complex manufacturing steps.

Parallel multi-segment signal lines in flexible display bending regions prevent damage and maintain uniform impedance during repeated folding.

A nonvolatile memory device shares thermal energy between adjacent resistance change elements via temporally overlapping write voltages.

A monolithic semiconductor chip integrates multiple functional regions with rear-side p and n contacts for simultaneous mounting.

Nitrogen gradients in SOI buried oxide layers block boron migration, reducing parasitic resistance and enhancing MOSFET drive current.

Zinc insert triggers eutectic reaction to remove oxide films, preventing base material softening during aluminum joining.

A GIS data collector application installed on legacy cellular phones enables field workers to record spatial features without dedicated hardware.

Cured insulating layers bridge narrow grooves between light emitting units, preventing wire disconnection across large height differences.

A segmented vacuum pumping system uses mechanical roughing followed by non-mechanical main pumping to achieve high vacuum levels.

A sectioned field effect transistor dynamically adjusts its main and sense sections to extend the current sensing range.

Ion-implanted regions reduce contact resistance and prevent phosphorus diffusion during wet etching.

An integrated touch sensor electrode structure encloses sub pixels in an organic electroluminescent display.

A multilayer protective film using alternating inorganic insulating layers blocks water vapor transmission to preserve organic light-emitting diode luminance.

A tapered cell profile creates asymmetric ion density regions to enhance memory sensing accuracy and resolve threshold voltage variations between logic states.

Extending a well region into the substrate reduces electric field concentration at the edge, resolving trade-offs between channel width and reliability.

Atomic layer deposition creates thin inorganic layers with compound oxides, resolving scalability limits while maintaining high resolution.

A semiconductor memory control unit adjusts select gate line voltage across program loops to set threshold voltages.

A closed drying system with constant volume prevents surface bubbles and thermal decomposition during organic solar cell manufacturing.

Nitrogen plasma treatment creates a passivation layer on copper thin film transistor electrodes, preventing barrier reduction and peeling during processing.

Inverting the sensor chip with through-silicon vias allows electrical connection while a front spacer prevents damage during handling.

Laser annealing increases resistance and threshold voltage by controlling phase states, resolving data retention reliability issues.

Segmenting electrode films with insulating plates increases storage density in stacked NAND flash memory without requiring tighter circuit miniaturization.

A laser mold removal method uses reflected light to measure thickness and adjust emission conditions.

Varying refractive indices in the encapsulation layer correct angle-dependent color shift, maintaining consistent display accuracy.

Positioning the lens outline outside the frame region allows light refraction that minimizes visible dark artifacts while maintaining central display quality.

Stepped cutting grooves in the inorganic layer and base channel deposition, preventing mask sagging cracks from propagating into the display area.

A junction isolated clamp circuit directs transient energy between power rails and signal nodes to manage voltage excursions.

Selective electric current on a heating substrate transfers pattern forming material to resolve mask sagging and improve precision.

Integral dam structure confines glob top overflow onto solder pads, ensuring proper solder ball placement and reducing manufacturing costs.

Amorphous fluororesin sealing resin protects nitride semiconductor ultraviolet light emitting elements from moisture and oxidation.

A coating method forms organic thin films under low humidity followed by high humidity storage to extend light emission life.

Vertical stacking positions sensing layers above the circuitry to prevent light blocking, resolving interference and improving image sensing capabilities.

Segmenting the memory array from the controller lowers manufacturing costs while maintaining high capacity.

Layer-selecting transistors segment stacked memory planes to resolve complex electrical interconnections and addressing bottlenecks.

Integrates drain and source selection gates on the same level to reduce wiring complexity in non-volatile memory devices.

An electrowetting underfill method charges filler with an electric field to control wetting and accelerate permeation between substrate and device.

Adjusting scanning electron microscope accelerating voltage to 5-20 kV creates distinct color differences between metallic and semiconducting carbon nanotubes.

Integrating a light shielding layer with the buried gate blocks stray light interference, reducing signal noise in image sensors.

A light-emitting component uses phosphorescent and fluorescent emitter materials in a single layer to produce mixed or pure light via current intensity control.

Relocating pixel electrode contact holes to the clearance between counter electrodes prevents contrast inversion and maintains high transmissivity.

Grouped alignment plates with guiding inserts correct position offsets using a single actuator set controlled by dual cameras.

Series PN junctions reduce parasitic capacitance while maintaining ESD protection.

Varying color resistance thickness in pixel electrode areas stabilizes liquid crystal tilt directions near connection patterns to improve light transmittance.

Segmenting bit-lines with intermediary plugs reduces capacitive load, accelerating pre-charge and discharge cycles in memory devices.

A protective film covers the upper electrode to enable reliable opening formation in the capacitance layer.