Display Panel Motherboard Cutting Grooves Prevent Crack Propagation

The patent applies preliminary action by forming cutting grooves in the inorganic layer and base layer before the deposition process. These pre-formed grooves serve as predetermined pathways that guide and confine the inorganic film deposition, preventing the film from extending into areas that would later become cutting zones. This preliminary structuring ensures that even with large mask sizes, the deposition remains controlled and does not cause cracking during subsequent cutting operations.

The patent converts the potentially harmful effect of inorganic film extension into a beneficial outcome by deliberately forming cutting grooves that channel the film extension in a controlled manner. Instead of preventing the film from extending (which would require smaller masks and reduced coverage), the invention allows the extension but guides it into pre-formed grooves that act as stress relief channels. This transforms the harmful crack propagation into a controlled feature that actually protects the display area from cracks.

The patent applies segmentation by dividing the substrate structure into distinct layers (inorganic layer and base layer) with cutting grooves formed in each. The cutting grooves are segmented into a first groove in the inorganic layer and a second groove in the base layer, creating a stepped cutting path. This segmented approach allows the cutting process to separate panels efficiently while the grooves themselves act as predetermined fracture lines that contain cracks within the cutting area and prevent them from reaching the display area.