OLED Display Substrate Heat Dissipation Layer Design

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Solution Overview

Problem

OLED display substrates face limitations due to excessive temperature, which can affect their normal operation and user experience, especially in applications like mobile terminals and head-mounted devices, where high temperatures can impact service life and display functionality.

Innovation Solution

A display substrate design that incorporates a heat dissipation layer between the base substrate and display elements, with electrodes connected via heat conducting structures to efficiently transfer and dissipate heat, utilizing materials like diamond-like materials, aluminum nitride, graphene, or carbon nanotubes for enhanced thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If OLED display substrate area or brightness is increased, then display performance is improved, but heat generation increases causing excessive temperature

Engineering Contradiction:
ImprovebrightnessVSAvoidtemperature
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the base substrate by introducing a dedicated heat dissipation layer. This layer is positioned between the base substrate and display elements, specifically extracting heat away from the active display regions to prevent excessive temperature buildup while maintaining display performance

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces heat conducting structures as intermediary components that mediate heat transfer between the display elements and the heat dissipation layer. These structures act as thermal conduits, efficiently transporting heat from the electrode regions through the insulating layers to the heat dissipation layer, thereby resolving the contradiction between maintaining heat generation for brightness and preventing excessive temperature

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation structures are added to reduce temperature, then temperature control is improved, but device structure becomes more complex

Engineering Contradiction:
Improvetemperature controlVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation layer is designed to serve multiple functions: it acts as a thermal management component, a structural support layer, and potentially a barrier layer. The heat conducting structures simultaneously provide thermal conduction and electrical insulation functions by integrating with the existing insulating layer structure, thereby reducing overall device complexity while achieving effective temperature control

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the heat conducting structures with the existing insulating layers, where the heat conducting structures penetrate through the insulating layers rather than being separate additions. This integration approach combines thermal management functionality with the existing device architecture, minimizing structural complexity while achieving effective heat dissipation

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces the temperature of the display substrate, preventing excessive heat from affecting normal operation and improving user experience by ensuring efficient heat dissipation and extending the service life of OLED display elements.

Implementation Method 1

an electrode of at least one of the plurality of display elements is connected to the heat dissipation layer via at least one heat conducting structure

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat dissipation layer arranged between the substrate and the plurality of display elements

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS10749144B2Display substrate and method for preparing the same, and display device
Publication Date: 2020.08.18 BOE TECHNOLOGY GROUP CO LTD
  • US10749144B2 patent drawing
  • US10749144B2 patent drawing
  • US10749144B2 patent drawing

AI summary

Provided is a display substrate, a method for preparing the same, and a display device. The display substrate includes a plurality of display elements arranged on a base substrate and a heat dissipation layer arranged between the substrate and the plurality of display elements, in which an electrode of at least one of the plurality of display elements is connected to the heat dissipation layer via at least one heat conducting structure.