Optical Module Alignment via Substrate Marks and Through-Holes
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Solution Overview
Problem
Existing optical modules face challenges with increased size and complexity due to the need for passive-active alignment using silicon optical benches, which results in a larger number of parts and longer alignment times.
Innovation Solution
The optical module employs a substrate with integrated optical elements and electronic components, an optical connector unit for holding fibers, and a cover with alignment marks and guide-pin holes, allowing for two-dimensional movement and active alignment without the need for a silicon optical bench, reducing the number of parts and size while enabling quick alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If passive-active alignment using silicon optical bench is employed, then alignment precision is improved, but device complexity and size increase
Solution Approach 1:
The patent extracts and removes the silicon optical bench from the optical module structure, replacing it with a simplified substrate-based alignment system. The alignment marks are directly formed on the substrate, eliminating the need for separate SiOB components while maintaining alignment precision through the through-hole visualization method.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, enables alignment through integrated alignment marks, and facilitates optical coupling. The through-holes in the optical connector unit also serve dual purposes as both structural features and alignment reference points, reducing the need for separate alignment components.
2Manufacturing precision
If passive-active alignment using silicon optical bench is employed, then alignment precision is improved, but manufacturing time increases
Solution Approach 1:
Alignment marks are pre-formed on the substrate during substrate fabrication, and through-holes are pre-positioned in the optical connector unit. This preliminary preparation eliminates the need for complex real-time alignment procedures, allowing operators to quickly achieve precise alignment by simply visualizing the alignment marks through the through-holes.
Solution Approach 2:
The alignment marks serve as visual intermediaries that bridge the gap between the optical elements and the connector position. By providing clear visual references that can be seen through the through-holes, the system mediates the alignment process, enabling quick and accurate positioning without complex measurement equipment or procedures.
3Stability of the object's composition
If silicon optical bench is used for passive alignment, then alignment stability is improved, but module size increases
Solution Approach 1:
The alignment reference system is merged directly into the substrate structure, with alignment marks formed as integral features of the substrate. The optical connector unit is merged with the assembly process, where its position is determined by the substrate's alignment marks rather than requiring a separate SiOB structure. This consolidation reduces overall module size while maintaining alignment stability.
Data Source
AI summary
An optical module 10 according to the invention is comprised of: a substrate 11; a laser diode array 14 implemented on said substrate in an array; a driver IC 15 implemented on said substrate and electrically connected to each of surface emitting semiconductor laser elements of the laser diode array 14; an optical connector unit 12 for holding a plurality of optical fiber 16 in an array, wherein the optical connector unit 12 is fixed to the substrate 11 in a location where center of each single end of said plurality of optical fiber and center of each light injecting region are aligned with each other; and a cover 13. The optical connector unit 12 includes two guide-pin holes 12b on two opposite sides of a plurality of fiber holding hole 12a. Two alignment marks 50 are provided on a surface 11a of the substrate 11, which are visually recognizable through each of the guide-pin holes 12b, and function as alignment reference of said optical connector unit 12.