Micro-LED Chip Transfer via Laser Ablation and Composite Resin
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Solution Overview
Problem
Conventional methods for mounting micro-LED chips on a circuit board are time-consuming and costly, and face limitations in precision and transfer efficiency, especially for chips smaller than 100 microns, due to the complexity and inefficiency of nozzle-based systems.
Innovation Solution
A method involving a composite resin layer with adhesive properties, combined with laser ablation and bonding, is used to improve the precision and speed of micro-LED chip transfer by forming a bonding structure between the micro-LED chips and the circuit board, utilizing a composite resin part to support the bonding structure and absorb impact during the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dedicated chip-bonding device with vacuum suction nozzles is used to pick up and place individual micro-LED chips, then precise one-to-one placement on electrodes is achieved, but the mounting process becomes time-consuming and productivity is reduced
Solution Approach 1:
The patent segments the micro-LED chips into groups arranged in arrays on separate carrier substrates. Instead of transferring individual chips one by one, multiple chips are transferred simultaneously as groups, dramatically increasing productivity while maintaining placement precision through the structured array arrangement and corresponding electrode patterns.
Solution Approach 2:
The patent merges multiple chip transfer operations into a single simultaneous transfer process. Multiple micro-LED chips are transferred from their respective carrier substrates to the target substrate at the same time, combining what would otherwise be sequential operations into one parallel process, thereby resolving the contradiction between precision and speed.
2Productivity
If multiple nozzle units are installed to increase mounting speed, then productivity is improved, but equipment complexity and cost increase
Solution Approach 1:
Instead of using multiple complex nozzle units, the patent segments the chip carriers into separate substrates, each holding an array of chips. This allows a single transfer mechanism to handle multiple chips simultaneously by transferring entire arrays at once, achieving high productivity without increasing equipment complexity.
Solution Approach 2:
The patent replaces the mechanical vacuum suction nozzle system with a laser-based transfer mechanism. Lasers are used to release and transfer chips from carrier substrates without requiring complex mechanical nozzles and vacuum systems, thereby achieving high-speed mounting while simplifying the equipment.
3Ease of operation
If vacuum suction nozzles are used to pick up micro-LED chips, then individual chip handling is achieved, but transfer capability for chips of 100 microns or less is limited
Solution Approach 1:
The patent replaces the vacuum suction mechanical system with a laser-based release mechanism. The laser provides precise, contactless energy to release chips from the carrier substrate, enabling accurate handling and transfer of extremely small chips (100 microns or less) without the size limitations inherent in mechanical nozzle systems.
Solution Approach 2:
The patent changes the fundamental parameter of chip release from mechanical suction force to optical energy input. By using laser irradiation instead of vacuum pressure, the system can effectively handle chips of any size including those 100 microns or less, as the laser can precisely target and release individual chips regardless of their dimensions.
4Productivity
If micro-LED chips are transferred at high speed, then productivity is improved, but transfer yield decreases due to impact and misalignment
Solution Approach 1:
The patent performs preliminary alignment by arranging chips in precise arrays on carrier substrates before transfer. The electrode patterns on the target substrate are designed to correspond with the chip array positions, ensuring that even during high-speed simultaneous transfer, each chip aligns correctly with its target electrode, maintaining high transfer yield despite increased speed.
Solution Approach 2:
The patent implements impact absorption measures by designing the chip transfer process to minimize impact forces. The simultaneous transfer mechanism and laser release system control the dropping speed and impact of chips onto the target substrate, preventing damage that would reduce transfer yield while maintaining high transfer speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-speed multi-transfer of micro-LED chips, improving productivity and transfer yield while minimizing defects due to misalignment or tilting, and supports precise seating of micro-LED chips on the circuit board.
Implementation Method 1
a third step of ablating the adhesive by irradiating each of the micro-LED chips with at least one first laser beam
Implementation Method 2
a fifth step of irradiating electrodes of the seated micro-LED chips with at least one second laser beam; and a sixth step of bonding electrodes of the circuit board and the electrodes of the micro LED chips by means of said irradiating with the at least one second laser beam
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A micro-LED display and a method for manufacturing same are disclosed. The disclosed micro-LED display may comprise: a circuit board; at least one first electrode formed on the circuit board; at least one micro-LED chip bonded onto the first electrode; a second electrode formed on the micro-LED chip; a bonding structure formed by heating the first electrode and the second electrode through laser irradiation; and at least one composite resin part supporting the bonding structure.