Active Matrix Substrate Wiring with Laminated Conductive Layers
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Solution Overview
Problem
The manufacturing process of active matrix substrates with lower source or gate structures faces challenges in forming low-resistance wiring connections due to surface damage of the source or gate metal layers, leading to increased contact resistance and adhesion issues with other conductive layers.
Innovation Solution
The implementation of a laminated structure combining a metal layer with a transparent conductive layer that covers both the upper and side surfaces of the metal layer in the wiring connection units, which helps protect the metal surface from damage and elution during etching, and allows for automatic repair of disconnections, thereby reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer is used for wiring connection units, then electrical conductivity is improved, but the metal surface is damaged during etching leading to increased contact resistance
Solution Approach 1:
The patent applies a laminated structure combining a metal layer with a transparent conductive layer. The metal layer provides high electrical conductivity for wiring connections, while the transparent conductive layer protects the metal surface from damage during etching processes. This composite structure resolves the contradiction by allowing the metal layer to function electrically while being shielded from harmful etching effects.
Solution Approach 2:
The transparent conductive layer acts as an intermediary between the metal layer and the etching environment. It serves as a protective barrier that prevents direct contact between the metal surface and etchants, thereby preventing surface damage while allowing the metal layer to maintain its electrical connection function.
2Reliability
If the source metal layer is positioned closer to the substrate, then parasitic capacitance is reduced, but the metal layer becomes more vulnerable to process damage
Solution Approach 1:
By forming a laminated structure of metal layer and transparent conductive layer, the patent enables the metal layer to be positioned closer to the substrate for reduced parasitic capacitance while the transparent conductive layer provides protection against process damage. This composite approach allows both benefits to coexist.
Solution Approach 2:
The transparent conductive layer is formed beforehand to cover and protect the metal layer before subsequent etching and manufacturing processes. This prior protective measure cushions the metal layer against process damage while allowing the metal layer to be positioned optimally for electrical performance.
3Ease of manufacture
If a single metal layer is used for wiring, then manufacturing is simplified, but contact resistance increases due to surface damage
Solution Approach 1:
The patent uses a laminated structure of metal layer and transparent conductive layer that maintains manufacturing simplicity while improving contact resistance control. The metal layer provides low-resistance electrical connection, and the transparent conductive layer prevents surface damage during processing, thereby reducing contact resistance without significantly complicating the manufacturing process.
Data Source
AI summary
An active matrix substrate includes: a substrate; lower bus lines and upper bus lines; a lower insulating layer positioned between the lower bus lines and the upper bus lines; an oxide semiconductor TFT that are disposed in each pixel region and have an oxide semiconductor layer disposed on the lower insulating layer; pixel electrodes disposed in each pixel region; and wiring connection units arranged in a non-display region. Each wiring connection unit includes: a lower conductive layer formed using the same conductive film as the lower bus lines; an insulating layer that extends on the lower conductive layer and includes the lower insulating layer. The lower bus lines and the lower conductive layer have a first laminated structure including a metal layer and a transparent conductive layer that covers an upper surface and a side surface of the metal layer.