Active Mold Package with Laser-Plated RDL for Thermal Stress Relief
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Solution Overview
Problem
Semiconductor device packages face challenges in accommodating sophisticated features that impact reliability, performance, and cost, particularly due to mismatched mechanical properties such as coefficient of thermal expansion.
Innovation Solution
The use of encapsulants formulated for selective activation by laser direct structuring, forming plated conductive traces through electroless plating, and eliminating mechanical property mismatches by using epoxy molding compounds with laser-activated metal particles, creating a build-up package substrate with interconnected traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging materials are used, then manufacturing simplicity is maintained, but mechanical property mismatch causes reliability degradation
Solution Approach 1:
The patent changes the material parameters of the encapsulant by incorporating metal particles (such as copper, nickel, or stainless steel) into the epoxy molding compound. This modification alters the coefficient of thermal expansion and other mechanical properties of the encapsulant to better match those of the semiconductor die and lead frame, thereby reducing mechanical stress and improving device reliability during thermal cycling.
Solution Approach 2:
The patent employs composite materials by combining metal particles with epoxy molding compound to create a multi-phase encapsulant material. This composite structure allows the encapsulant to simultaneously provide mechanical support, electrical insulation, and matched thermal expansion characteristics, resolving the contradiction between reliability and material simplicity.
2Adaptability or versatility
If sophisticated features are added to semiconductor devices, then functionality is improved, but package configuration becomes susceptible to lower reliability and higher costs
Solution Approach 1:
The patent applies local quality by incorporating metal particles selectively into specific regions or layers of the encapsulant material. This allows different portions of the packaging to have tailored mechanical properties, enabling the package to accommodate sophisticated device features while maintaining overall reliability through localized property optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances semiconductor device reliability by minimizing mechanical stresses, thereby improving overall performance and reducing costs.
Implementation Method 1
Openings through the subsequent encapsulant and patterned paths are formed using laser ablation thus activating the first encapsulant at the sidewalls of the openings and along the patterned paths
Implementation Method 2
forming plated conductive traces through electroless plating
Data Source
AI summary
A method of forming a semiconductor device is provided. The method includes forming a conductive die connector having a first end connected to a die pad of a semiconductor die. A first encapsulant formulated for selective activation by way of a laser encapsulates at least a portion of the semiconductor die. A first conductive trace of a redistribution layer is formed by plating a conductive material on a first laser activated path on a first major surface of the first encapsulant. The first conductive trace is directly connected to a second end of the die connector. A second encapsulant formulated for selective activation by way of a laser encapsulates at least the first conductive trace and exposed portions of the first major surface of the first encapsulant.