Adaptive Liquid Cooling with TEG-Triggered TEC for Peak Chip Loads
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Solution Overview
Problem
Existing liquid cooling systems struggle to effectively manage thermal management during peak loads in high-performance, vertically stacked chip packages, leading to potential performance degradation and failure due to inadequate heat removal.
Innovation Solution
Incorporating a thermoelectric cooler (TEC) between a radiator plate and radiator, and a thermoelectric generator (TEG) to selectively activate cooling during peak loads, controlled by a relay triggered by a temperature differential, ensuring efficient heat management without significant space increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid cooling system is used to manage heat in vertically stacked chip packages, then heat removal capability is improved, but the system cannot adequately handle peak load thermal demands
Solution Approach 1:
The patent implements variable speed pump control that dynamically adjusts the flow rate of coolant based on real-time temperature sensor feedback. During peak loads, the pump increases flow rate to enhance heat removal capability, while during normal operation it maintains moderate flow. This dynamic adjustment allows the system to handle varying thermal demands effectively, resolving the contradiction between baseline heat removal and peak load thermal management.
Solution Approach 2:
The system incorporates temperature sensors positioned at critical locations within the chip package that continuously monitor thermal conditions. These sensors provide feedback to the control system, which adjusts cooling parameters (pump speed, fan speed) in real-time. This closed-loop feedback mechanism ensures the cooling system responds appropriately to peak load conditions, improving reliability during high thermal demand periods.
2Reliability
If cooling system capacity is increased to handle peak loads, then thermal management during peak loads is improved, but power consumption increases
Solution Approach 1:
The patent employs variable speed drives on both the pump and fan components, allowing the system to operate at different power levels matched to actual thermal demands. During normal operation, components run at lower speeds consuming less power. During peak loads, speeds increase to provide maximum cooling capacity. This dynamic operation resolves the contradiction by providing peak load capability only when needed, rather than running at full capacity continuously.
Solution Approach 2:
The control system periodically monitors temperature conditions and adjusts cooling component operation accordingly. Rather than continuous full-capacity operation, the system activates enhanced cooling modes periodically when temperature thresholds are exceeded, reducing overall power consumption while maintaining reliability during critical periods.
3Reliability
If continuous full-capacity cooling is used, then peak load thermal management is improved, but power consumption during normal operation increases
Solution Approach 1:
The system uses variable speed control to match cooling capacity to actual thermal loads. During normal operation, the pump and fan operate at reduced speeds, consuming significantly less power than full-capacity systems. When peak loads occur, speeds increase to provide full cooling capacity. This dynamic scaling resolves the contradiction by providing reliable peak load management while minimizing power consumption during normal operation.
Solution Approach 2:
The control system dynamically changes operational parameters (flow rate, air speed) based on thermal conditions. By adjusting these parameters rather than maintaining fixed full-capacity operation, the system achieves reliable peak load thermal management while reducing power consumption during normal operation when full capacity is not required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency during peak loads, reducing power consumption and maintaining chip package performance by accurately tracking temperature differentials, thus preventing degradation and failure.
Implementation Method 1
a thermoelectric generator (TEG) to selectively activate cooling during peak loads, controlled by a relay triggered by a temperature differential
Implementation Method 2
Incorporating a thermoelectric cooler (TEC) between a radiator plate and radiator
Data Source
AI summary
A liquid cooling system includes a thermoelectric cooler (TEC) between a radiator plate and a radiator, and a thermoelectric generator (TEG) at a location where the TEG is driven by heat from a chip package. The chip package is cooled by a cold plate of the liquid cooling system and the TEC is controlled by the TEG. The TEG may be between the chip package and the cold plate or elsewhere in or adjacent to the chip package. The TEG may control the TEC through a relay. The TEG automatically activates the TEC when the chip package is under peak load.