Adaptive Termination Controller for Multi-Chip Package Signal Lines

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Solution Overview

Problem

As the number of semiconductor chips in multi-chip packages increases, signal transmission delays occur due to increased loading on signal transmission lines, hindering high-speed data transmission and leading to higher power consumption.

Innovation Solution

A multi-chip package system that includes a termination controller to detect the loading value of signal transmission lines and control termination operations based on this value, enabling adaptive management of signal transmission to balance speed and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of semiconductor chips is increased to increase memory capacity, then the memory capacity is improved, but the loading of the signal transmission line is increased causing signal transmission delay

Engineering Contradiction:
Improvememory capacityVSAvoidsignal transmission speed
Core Design Contradiction:
Quantity of substanceVSSpeed

Solution Approach 1:

The patent applies dynamics by making the termination operation adjustable based on the number of connected semiconductor chips. The termination controller dynamically enables or disables termination operations according to the actual loading conditions, allowing the system to adapt to varying numbers of chips connected to the signal transmission line, thereby optimizing signal transmission speed for different memory capacity configurations.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the termination parameter (enabling/disabling termination operation) based on the loading value detected from the number of semiconductor chips. By adjusting this parameter according to actual usage conditions, the system resolves the contradiction between maintaining high signal transmission speed and supporting increased memory capacity through multiple chips.

Inventive Principle:
Principle #35Parameter changes

2Quantity of substance

If the number of semiconductor chips is increased to improve performance, then the memory capacity is improved, but the power consumption is increased due to continuous termination operations

Engineering Contradiction:
Improvememory capacityVSAvoidpower consumption
Core Design Contradiction:
Quantity of substanceVSUse of energy by moving object

Solution Approach 1:

The patent implements periodic action by controlling termination operations to be performed only when necessary (when the number of connected chips exceeds a threshold) rather than continuously. The termination controller periodically assesses the loading value and enables termination operations only during periods when high loading is detected, reducing unnecessary power consumption while maintaining performance when needed.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The system dynamically adjusts power consumption by enabling termination operations only when the loading value indicates high memory capacity usage. This dynamic control allows the system to maintain high performance when needed while minimizing power consumption during low-utilization periods, resolving the contradiction between memory capacity and power efficiency.

Inventive Principle:
Principle #15Dynamics

3Reliability

If termination operation is continuously performed to maintain signal transmission quality, then the signal transmission reliability is improved, but the power consumption is increased

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent employs feedback by having the termination controller detect the loading value of the signal transmission line and adjust termination operations accordingly. This feedback mechanism ensures that termination operations are performed only when the loading value indicates a need for signal quality maintenance, thereby maintaining reliability while avoiding unnecessary power consumption during low-loading conditions.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system dynamically controls termination operations based on real-time loading conditions, making termination reliability adaptive rather than static. This dynamic approach maintains signal transmission reliability when needed while reducing power consumption when the transmission line loading is low, resolving the contradiction between reliability and energy efficiency.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS9275984B2Multi-chip package system
Publication Date: 2016.03.01 SK HYNIX INC
  • US9275984B2 patent drawing
  • US9275984B2 patent drawing
  • US9275984B2 patent drawing

AI summary

A multi-chip package system includes a signal transmission line commonly coupled to a plurality of semiconductor chips to transfer data to/from the semiconductor chips from/to outside; and a termination controller suitable for detecting a loading value of the signal transmission line and controlling a termination operation on the signal transmission line based on the loading value.