ADAS MCM Package With Symmetrical DRAMs and Liquid Cooling
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in achieving high DDR bandwidth, efficient power delivery, and cost-effectiveness, particularly in automotive-grade applications like advanced driver assistance systems (ADAS), with inefficiencies in thermal management and mechanical stability.
Innovation Solution
A multi-chip module (MCM) package integrating ADAS SoC and multiple DRAMs in a single package, utilizing a customized PCB with liquid cooling and a thermal-mechanical testing vehicle (TMTV) to optimize thermal and mechanical performance, and a symmetrical DRAM placement around the SoC for balanced warpage distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple DRAMs and ADAS SoC are integrated into a single MCM package, then cost is reduced and power delivery is improved, but thermal management becomes more challenging
Solution Approach 1:
Multiple DRAM chips and ADAS SoC are integrated into a single MCM package, combining multiple components that would traditionally be separate. This merging reduces the number of individual packages and interconnections, lowering manufacturing cost while improving power delivery efficiency through shared power networks.
Solution Approach 2:
A liquid cooling system is introduced as an intermediary thermal management solution between the high-density MCM package and the environment. The liquid cooling plates and channels act as mediators to efficiently extract heat from the compact package, addressing the thermal management challenges created by component integration.
2Stability of the object's composition
If DRAMs are placed symmetrical to SoC in MCM package, then warpage is minimized and mechanical stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies symmetrical placement of DRAMs around the central ADAS SoC, creating a balanced mechanical structure. This symmetrical arrangement distributes thermal and mechanical stresses uniformly, minimizing warpage and improving overall package stability, though it requires precise manufacturing to achieve the symmetrical configuration.
3Temperature
If MCM package with liquid cooling is used, then thermal management is enhanced, but device complexity increases
Solution Approach 1:
A liquid cooling system with cooling plates and fluid channels is integrated into the MCM package. This hydraulic thermal management system uses circulating liquid to efficiently remove heat from the high-density electronic components, providing superior cooling performance compared to passive methods.
Solution Approach 2:
The MCM package structure serves multiple functions simultaneously: it provides mechanical support for multiple chips, establishes electrical connections through substrate interconnects, manages thermal loads through integrated liquid cooling, and ensures mechanical stability through symmetrical component placement. This multi-functionality reduces the need for separate dedicated components.
4Productivity
If high-density MCM integration is implemented, then DDR bandwidth is enhanced, but manufacturing difficulty increases
Solution Approach 1:
The patent transitions from two-dimensional planar arrangements to three-dimensional vertical stacking of multiple DRAM chips around the central ADAS SoC. This dimensional change enables higher DDR bandwidth by providing multiple memory interfaces in the vertical dimension while managing the increased manufacturing complexity through standardized stacking processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MCM package achieves reduced cost, improved power delivery, enhanced thermal management, and increased reliability by ensuring DDR bandwidth, minimizing warpage, and optimizing power delivery, while the TMTV ensures comprehensive thermal and mechanical testing.
Implementation Method 1
liquid cooling system
Implementation Method 2
thermal-mechanical testing vehicle (TMTV) to optimize thermal and mechanical performance
Data Source
AI summary
Aspects of the disclosure relate to automotive grade MCM technology which may include advanced driver assistance system (ADAS) system-on-chip and multiple dynamic random access memories (DRAMs) in one package. In addition, a thermal-mechanical testing vehicle (TMTV) may be used to mimic ADAS chips on ADAS system from thermal, mechanical, or manufacturability perspective. There may be a system which includes multiple MCM components designed into a customized printed circuit board (PCB) with a liquid cooling system.