Additive Conductive Pattern Formation on Protective Film
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Solution Overview
Problem
Existing methods for manufacturing compact and highly integrated wiring boards with built-in electronic elements face challenges in forming fine conductive patterns and ensuring reliable connections, as they often rely on subtractive methods that can damage patterns and require complex etching processes.
Innovation Solution
A method involving the formation of a protective film on a metal foil, creation of a conductive pattern using an additive method, placement of an electronic element with its circuit surface facing the pattern, covering with insulative resin, and selective etching to connect terminals, where the protective film acts as an etching resist to protect the pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a subtractive method is used to form conductive patterns, then existing manufacturing processes can be utilized, but the conductive patterns may be damaged and connection reliability is compromised
Solution Approach 1:
The patent inverts the conventional subtractive approach by using an additive method to form the conductive pattern. Instead of etching away material to create the pattern, the conductive material is deposited only where needed through electroplating on a protective film, thereby avoiding pattern damage while achieving reliable connections.
Solution Approach 2:
The patent introduces a protective film as an intermediary layer between the metal foil and the etching solution. This protective film serves as a mask during etching and as a substrate for conductive material deposition, enabling the additive pattern formation while protecting the underlying metal foil from damage.
2Productivity
If an etching solution is used to remove metal foil, then the metal foil can be selectively removed, but the etching process becomes complex and time-consuming
Solution Approach 1:
The patent applies a protective film to the metal foil before the etching process. This preliminary action creates a mask that protects specific areas from etching, allowing selective removal of metal foil without requiring complex masking steps during the etching process itself, thereby simplifying and accelerating the overall manufacturing process.
3Manufacturing precision
If finer conductive patterns are formed, then board integration is improved, but pattern alignment and connection reliability become more difficult to ensure
Solution Approach 1:
The patent employs an additive electroplating process where the conductive material is deposited directly onto the protective film in the desired pattern. This self-service approach allows the pattern to be formed with high precision through controlled deposition, and the protective film itself serves as the alignment reference, ensuring that finer patterns maintain their integrity and alignment without requiring additional alignment steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of finer conductive patterns, enhances connection reliability, and simplifies the manufacturing process by maintaining pattern configuration integrity and facilitating easier alignment and bonding of electronic elements.
Implementation Method 1
etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil
Implementation Method 2
forming a conductive pattern made of a metal material on the protective film by an additive method
Data Source
AI summary
A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern.