Printed Circuit Assembling TRIZ Cases

Embedding a solder mesh within the adhesive layer deflects cracks toward shear paths, resolving bond line uniformity and peel fracture risks.

Pre-drilled holes embed cylindrical passive components within the printed circuit board substrate to minimize interconnect lengths.

A component replenishment support system predicts feeder shortage times to schedule worker actions before parts run out.

A motor vehicle conductor track unit embeds conductive paths in insulating material while exposing connection points for external component attachment.

A chip electronic component uses an interposer with recessed terminal electrodes to support a ceramic body and maintain electrical connectivity.

Consolidating individual pixels into integrated packages reduces interconnect complexity and material costs while maintaining independent pixel control.

A laser welding process joins a bus bar to a conductive track on a power circuit board, accommodating thick bus bars by restricting thickness at the weld spot.

Silicone-based damper material absorbs capacitor vibration to reduce acoustic noise without increasing device height or manufacturing complexity.

Embedding a silicon interposer and sheet-shaped member at symmetrical positions reduces warpage in coreless wiring substrates during reflow soldering.

Segmenting electrodes with glass films prevents stress concentration at through hole boundaries.

A multilayer ceramic capacitor with specific length and width dimensions matches reduced-size mounting substrates.

An inward protruding portion inside a wiring board through hole retains electronic components, resolving mounter accuracy issues during assembly.

Pasting a force sensor patch onto earphone PCB electrodes eliminates bulky retention components, reducing internal space occupancy and simplifying assembly.

A mounted structure reinforces bonding parts with a member between joints, resolving Sn-Bi solder fragility while maintaining low temperature processing.

Liquid crystal polymer solder mask aligns with circuit pads via laser milling, resolving package size constraints.

Adhesive bonding and conductive vias replace solder in flexible circuits, eliminating lead toxicity while maintaining connection reliability.

Segmented cover parts with high porosity exterior layers remove residual carbon from multilayer ceramic capacitors during sintering.

A circuit board manufacturing method creates conductor patterns and contact openings on a carrier substrate before attaching components.

A pattern forming method using an alkali-developable thermosetting resin composition with a photobase generator to create precise circuit patterns.

A solder transfer substrate uses a porous base layer with holes to guide peeling-off liquid toward an expanding adhesive layer.

A power conversion device integrates a plate-like busbar overlapping a printed wiring board conductive pattern to split current flow.

A multilayer ceramic capacitor uses segmented internal electrode regions to reduce direct current resistance and enhance high-frequency noise removal.

An urging member holds a filling squeegee at a fixed distance from the mask plate, eliminating complex control devices while preserving print quality.

A wiring substrate uses a high thermal expansion resin layer to correct component warping during manufacturing.

Embedding a dummy component with a detection mark improves positional accuracy of conductor patterns without increasing process complexity.

Three-stage insert molding segments a circuit board connector into core, outer, and case resin layers to reduce apparatus size.

Terminal protrusions rise above the insulating cover layer to resolve contact blockage and improve connection reliability.

A write head guides wire through a gap onto an adhesive layer while a payout mechanism maintains slack during parallel motion.

A raised metal pad with a thicker base portion and higher expansion top layer reduces interfacial breaks caused by thermal mismatch.

Segmented adhesive layers enable daughter board removal from mother boards without film damage or residue accumulation.

Offset solder paste supply to an uncovered third region adjacent to the electrode pad.

A substrate notch portion precisely positions an imaging element electrode pad to enhance electrical connection peeling strength.

Capillary forces from a liquid layer secure a micro device on a conductive pad, improving positioning precision for components under 100 μm.

Laser-induced forward transfer deposits precise molten solder droplets to resolve the contradiction between manufacturing precision and process complexity.

Segmented paper winding removes paste from convex mask portions, preventing cross-contamination and maintaining screen printing precision.

Magnetic coupling drives a screw pump while a floating seal isolates the rotating shaft from molten solder, eliminating oxide generation around the shaft.

A stacked expanded circuit board suppresses crosstalk interference in high-speed RJ45 connectors, eliminating welding and improving assembly efficiency.

Embedded conductive vias in multi-layer ceramic feedthroughs create customizable contact arrays that maintain voltage standoff across vacuum boundaries.

Extended solder portions over recessed terminal regions reduce tear-off stress on flexible carrier strip joints during rigid PCB insertion.

Auxiliary flexible circuit board provides dedicated test points to measure power consumption and impedance without damaging main circuit integrity.

Patterned internal electrodes with metal oxide regions reduce equivalent series inductance to cancel high-frequency noise.

Through-chip vias connect sensor circuitry to the back side of a capacitive fingerprint sensor chip.

A hermetically sealed printed circuit board protects electronic components within a cap-based chamber.

An intelligent soldering cartridge uses a processor to monitor power levels and detect liquidus occurrence for reliable joint formation.

Multi-layer component built-in board stacks double-sided boards with intermediate insulating layers to house electronic components.

A protective film acts as an etching resist during selective removal of the underlying metal foil, preserving pattern integrity and connection reliability.

A 2D-3D inspection method measures solder height and volume on warped substrates using optical detection.

A waterproof vehicle electronic control unit housing seals interfaces using injected material within a formed cavity.

A dual-head mounting apparatus uses interchangeable work units to handle diverse component types.

A conductive polymeric member bonds circuit board ground planes via a press-fit mechanism.