Component-Embedded Substrate Dummy Component Alignment

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Solution Overview

Problem

Existing methods for forming conductor patterns on component-embedded substrates face challenges in achieving high positional accuracy due to complex processes and resin flow issues, leading to low actual positional accuracy.

Innovation Solution

A component-embedded substrate is manufactured by embedding both the electronic component and a dummy component in an insulating resin base, with a mark on the dummy component serving as a reference for forming the conductor pattern, using a connection layer like solder or adhesive, and a reference hole for improved alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a mark is formed on the core substrate to improve positional accuracy, then the positional accuracy of the conductor pattern is improved, but the process complexity and labor increase

Engineering Contradiction:

Improvepositional accuracy of conductor patternVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention uses a dummy component as a copy or replica of the actual component, placing it in a known position on the substrate. The dummy component serves as a reference marker that simplifies the alignment process for forming conductor patterns, eliminating the need for complex marking and detection procedures while maintaining high positional accuracy

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The dummy component is positioned in advance at a predetermined location on the substrate before conductor pattern formation. This preliminary placement establishes a reference point that guides subsequent alignment operations, allowing conductor patterns to be accurately positioned relative to actual components without requiring complex real-time measurement and adjustment procedures

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If multiple holes are formed as references in different processes, then alignment reference is provided, but the actual positional accuracy remains low and resin flows into holes

Engineering Contradiction:

Improvealignment reference accuracyVSAvoidactual positional accuracy

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

Instead of using multiple physical holes as references across different processes, the invention uses a single dummy component that serves as a comprehensive reference marker. This dummy component remains intact throughout all manufacturing processes, providing consistent alignment information without the problems of resin infiltration or reference degradation that occur with multiple hole-based references

Inventive Principle:

Principle #26Copying

3Ease of manufacture

If conventional alignment methods are used, then the process is simple, but difficulty arises in aligning the pattern with the terminals of the component

Engineering Contradiction:

Improveprocess simplicityVSAvoidpattern alignment with component terminals

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The dummy component acts as a simplified reference model that captures the essential positioning information needed for alignment. By using this dummy component as a reference during conductor pattern formation, the system maintains process simplicity while achieving accurate alignment between patterns and actual component terminals, as the dummy component's known position enables straightforward reference-based alignment

Inventive Principle:

Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the positional accuracy of the conductor pattern relative to the embedded component without adding complexity, utilizing the self-alignment effect of solder or adhesive and allowing for efficient processing by using identical materials for the dummy and insulating base.

Implementation Method 1

utilizing the self-alignment effect of solder or adhesive

Methodology Applied

Scientific EffectSelf-alignment effect:

Implementation Method 2

The buried mark is detected by means of X rays to form a through hole passing through the mark

Methodology Applied

Scientific EffectX-ray detection: X-Ray

Data Source

PatentUS8921706B2Component-embedded substrate, and method of manufacturing the component-embedded substrate

Publication Date: 2014.12.30 MEIKO ELECTRONICS CO LTD

AI summary

A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.