Multi-layer Ceramic Vacuum Feedthrough with Embedded Conductors
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Solution Overview
Problem
Conventional electrical feedthroughs for vacuum chambers are not easily customizable and lack the ability to provide high-density custom arrays of contacts with higher voltage standoffs, making them unsuitable for applications requiring flexible and reliable electrical connections between vacuum and atmosphere environments.
Innovation Solution
A multi-layer ceramic feedthrough with embedded conductors forming custom arrays of conductive contacts on both surfaces, paired with flexible printed circuit cables and optional interposers, allowing for customizable contact patterns and higher voltage standoffs, fabricated by stacking green ceramic sheets with conductive paste-filled via holes and co-firing to create a hermetically sealed structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional glass-to-metal seal feedthroughs or ceramic-metal brazed pins are used, then electrical connection is provided, but customization capability and contact density are limited
Solution Approach 1:
The feedthrough is divided into multiple thin green ceramic sheets stacked together, with conductive paste applied to specific areas of each sheet. This segmentation allows independent customization of contact patterns on each layer, enabling complex 3D contact arrays while maintaining manufacturing simplicity through standardized stacking procedures
Solution Approach 2:
The invention transitions from conventional 2D contact surfaces to 3D embedded contact arrays by stacking multiple ceramic sheets with conductive paste at different positions and orientations. This adds the vertical dimension (Z-axis) to contact arrangement, enabling high-density custom contact patterns that cannot be achieved with flat surface mounts
2Quantity of substance
If higher density contact arrays are implemented, then electrical connection density increases, but voltage standoff capability may be compromised
Solution Approach 1:
Conductive paste-filled via holes are embedded within the ceramic matrix, nesting the conductive elements inside the insulating ceramic structure rather than placing them on the surface. This nesting provides natural electrical isolation and voltage standoff, allowing high contact density while maintaining reliable insulation between adjacent contacts and between contacts and the chamber wall
3Adaptability or versatility
If custom contact patterns are created, then application versatility improves, but manufacturing complexity increases
Solution Approach 1:
Conductive paste is applied to green ceramic sheets before firing, establishing the complete 3D contact array pattern in advance during manufacturing. This preliminary action allows complex custom patterns to be defined once during fabrication, after which the same molded ceramic body can be repeatedly produced with identical customized contact patterns, simplifying subsequent manufacturing and assembly
Solution Approach 2:
The invention changes the physical state and properties of materials during manufacturing: green ceramic sheets are fired to form hard ceramic, conductive paste is sintered to form embedded conductors. These parameter changes (temperature, density, conductivity) are controlled during the firing process to achieve the desired contact patterns and electrical properties in a single manufacturing step
Data Source
AI summary
Embodiments of this invention use multi-layer ceramic substrate with one or more hermetically sealed and filled metal vias with smaller pitch and size in combination with flexible printed circuit cables and interposers to provide a custom electric feed through for vacuum to atmosphere chambers. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.