Imaging Module Substrate Notch Positioning for Endoscope Reliability
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Solution Overview
Problem
Existing imaging modules for endoscopes face challenges in accurately positioning and reliably connecting solid-state imaging elements to substrates due to complex multilayer substrate configurations, which are difficult to manufacture and prone to short-circuits, and require precise assembly and high-cost production.
Innovation Solution
An imaging module design featuring electrode pads on both sides of the substrate with notch portions for precise positioning and a conductive connecting material to securely attach the imaging element, enhancing the peeling strength and reliability of the electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer substrate structure is used to connect the imaging element to the cable, then the electrical connection is achieved, but the manufacturing complexity increases and positioning accuracy becomes difficult to secure
Solution Approach 1:
The substrate is divided into a connection portion (with electrode pads for imaging element connection) and a cable connection portion (with through holes for cable passage), simplifying the overall structure while maintaining electrical connection functionality. This segmentation eliminates the need for complex multilayer configurations.
Solution Approach 2:
The cable connection function is extracted from the imaging element mounting area, with cables passing through dedicated through holes in the substrate rather than requiring complex integrated multilayer routing. This separation simplifies manufacturing and improves positioning accuracy.
2Reliability
If a T-shaped multilayer substrate is used to achieve the connection, then the electrical connection is established, but the number of layers increases significantly causing cost increase and manufacturing difficulty
Solution Approach 1:
The substrate structure is segmented into functional regions (imaging element connection area with electrode pads, cable passage area with through holes) on a single layer or minimal layers, eliminating the need for extensive multilayer construction while maintaining all necessary electrical connections.
Solution Approach 2:
The invention uses a simpler, more cost-effective substrate structure that can be manufactured using standard single-layer or low-layer PCB techniques rather than expensive complex multilayer processes, making the overall device more economical without sacrificing connection reliability.
3Manufacturing precision
If a block is fixedly adhered to the flexible substrate to maintain shape and mounting accuracy, then the mounting accuracy is secured, but the assembly process becomes troublesome and complex
Solution Approach 1:
The substrate itself provides the necessary structural support and shape maintenance through its rigid or semi-rigid construction with integrated through holes and electrode pads, eliminating the need for separate blocking components. The substrate serves its own structural function, simplifying assembly.
Solution Approach 2:
The structural support function and electrical connection function are merged into a single substrate component. The substrate simultaneously provides mechanical support, maintains shape, establishes electrical connections via electrode pads, and guides cable routing through integrated through holes, eliminating the need for separate blocking components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution allows for easy and accurate positioning of the imaging element on the substrate, improving the long-term stability and reliability of the electrical connection, while simplifying the manufacturing process and reducing costs.
Implementation Method 1
an electrode pad provided on a rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate are electrically connected via a conductive connecting material portion
Data Source
AI summary
An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.