Alkali-Developable Thermosetting Resin for PCB Pattern Formation
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Solution Overview
Problem
Conventional photocurable thermosetting resin compositions face challenges in achieving sufficient curing characteristics and pattern formation due to ester bonds from epoxy acrylate, while thermosetting resin compositions without photocurable structures are limited in pattern formation methods and require increased task time for laser processing.
Innovation Solution
A pattern forming method using an alkali-developable thermosetting resin composition with a photobase generator, where a resin layer is formed, irradiated with light to activate the photobase generator, and developed with an alkali solution to create a patterned layer, allowing for selective curing and reducing distortion and shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a photocurable resin composition containing epoxy acrylate is used, then pattern formation by light irradiation and development is enabled, but sufficient curing characteristics and desmear resistance cannot be attained
Solution Approach 1:
The patent combines a photocurable resin composition (containing epoxy acrylate for pattern formation) with a thermosetting resin composition (containing phenolic resin for excellent curing characteristics and desmear resistance). This merging allows the resulting composition to achieve both pattern formation capability by light irradiation and sufficient curing characteristics with good desmear resistance, resolving the technical contradiction between ease of manufacture and reliability.
2Reliability
If a thermosetting resin composition without photocurable structure is used, then excellent curing characteristics are achieved, but pattern formation is restricted to printing or laser processing with increased task time
Solution Approach 1:
The patent merges a thermosetting resin composition (providing excellent curing characteristics) with a photocurable resin composition (enabling rapid pattern formation by light irradiation). The resulting composition maintains the excellent curing characteristics of the thermosetting resin while enabling fast pattern formation through photolithography, eliminating the need for time-consuming laser processing or printing methods.
3Productivity
If photocurable resin composition is used for both sides of printed circuit board, then manufacturing efficiency is improved, but solder resist layer on one side cannot achieve sufficient curing characteristics
Solution Approach 1:
The patent applies different resin compositions to different sides of the printed circuit board based on local requirements. The side requiring excellent curing characteristics and desmear resistance uses the thermosetting resin composition containing phenolic resin, while the other side can use the photocurable resin composition. This local differentiation allows each side to have optimized properties for its specific function while maintaining overall manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of patterned layers with excellent curing characteristics in a short time, inhibiting distortion and shrinkage, and allows for the creation of printed circuit boards with precise openings using laser processing.
Implementation Method 1
activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a negative pattern so as to cure an irradiated part
Implementation Method 2
forming a negatively patterned layer by removing a non-irradiated part by alkali development
Data Source
AI summary
[Problem] Provided are: a pattern forming method by which a pattern can be formed by development using a thermosetting resin composition and a cured layer having excellent curability can be obtained; a thermosetting resin composition used in the pattern forming method; and a printed circuit board.[Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a pattern form so as to cure an irradiated part; and (C) forming a negatively patterned layer by removing a non-irradiated part by alkali development.