Component Built-in Board Thinning via Intermediate Insulator Integration
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Solution Overview
Problem
Conventional multi-layer printed wiring boards face challenges in achieving thinning due to the use of thicker insulator spacers and complex manufacturing processes, making it difficult to integrate electronic components effectively.
Innovation Solution
A component built-in board with a multi-layer structure comprising double-sided and single-sided boards, where electronic components are housed in openings of the double-sided boards and stacked with intermediate boards, reducing the number of insulator spacers and simplifying the manufacturing process through thermal compression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulator spacers thicker than the built-in electronic component are disposed between printed wiring boards, then the electronic component can be built in with proper spacing, but the overall thickness of the multi-layer printed wiring board increases and the manufacturing process becomes complicated
Solution Approach 1:
The patent extracts the insulator spacer function from a separate component and integrates it into the intermediate board structure itself. The intermediate board's insulating layer serves as both the structural base and the spacing element, eliminating the need for separate insulator spacers and reducing overall board thickness while maintaining proper component spacing.
Solution Approach 2:
The patent merges multiple functions into the intermediate board: it provides structural support, electrical insulation, and component spacing simultaneously. The insulating layer of the intermediate board combines the functions of both the traditional insulator spacer and the structural intermediate layer, simplifying the overall structure.
2Reliability
If insulator spacers are used to create air gaps for building in electronic components, then components can be properly housed, but the manufacturing process becomes more complex
Solution Approach 1:
The patent removes the insulator spacer as a separate manufacturing step and integrates the spacing function directly into the intermediate board's insulating layer structure, reducing the number of discrete components and assembly steps required.
Solution Approach 2:
The intermediate board's insulating layer serves multiple functions: it provides electrical insulation between wiring layers, maintains structural integrity, and creates the necessary spacing for component housing. This multi-functionality reduces the number of separate components needed.
3Adaptability or versatility
If multiple insulator spacers are stacked to create multi-layer structure with built-in components, then electronic components can be integrated across layers, but the overall board thickness increases
Solution Approach 1:
The patent combines the intermediate board structure with the insulator spacer function, eliminating the need for separate insulator spacers in each layer transition. The insulating layer of each intermediate board provides both structural support and spacing, reducing cumulative thickness while maintaining multi-layer integration.
Solution Approach 2:
The patent uses thin insulating layers within the intermediate boards to provide sufficient spacing and insulation without adding excessive thickness. The insulating layers act as thin film barriers that maintain electrical isolation and component spacing with minimal thickness contribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for overall thinning of the component built-in board while maintaining mechanical strength and insulating reliability, simplifying the manufacturing process and reducing the thickness of the electronic component storage area.
Implementation Method 1
a first adhesive layer laminated on both surfaces of the second insulating layer
Implementation Method 2
filling a via hole penetrating the insulating layer and the adhesive layer with conductive paste
Data Source
Figure 1~2
Figure 3~5
Figure 6A~6E
AI summary
A component built-in board(1) of multi-layer structure that has a plurality of unit boards stacked therein and is configured having a plurality of electronic components (90) built in thereto in a stacking direction, wherein the plurality of unit boards include : a double-sided board (10) that includes a first insulating layer(11), a first wiring layer (12) formed on both surfaces of the first insulating layer (11), and a first interlayer conductive layer(13) that penetrates the first insulating layer (11) and is connected to the first wiring layer(12), and that comprises an opening(19) in which the electronic component (90) is housed; and an intermediate board (20) that includes a second insulating layer (21), a first adhesive layer(22) provided on both surfaces of the second insulating layer(21), and a second interlayer conductive layer(23) that penetrates the second insulating layer (21) along with the firstadhesive layer(22), and the double-sided board (10) is disposed in each of a layer above and a layer below the intermediate board(20).