Multiple Pixel LED Package Reducing Interconnect Complexity
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Solution Overview
Problem
The complexity and cost of interconnects in large LED displays increase with the number of pixels, leading to manufacturing challenges and potential failures, as well as higher material and handling costs due to the use of single pixel LED packages.
Innovation Solution
The development of multiple pixel LED packages, where each package comprises multiple LEDs arranged in various formats, allowing for reduced pitch between pixels, lower material costs, and simplified interconnects, enabling higher resolution displays with reduced manufacturing costs and potential failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If single pixel LED packages are used, then each pixel can be independently controlled and assembled, but the interconnect complexity and manufacturing cost increase with the number of pixels
Solution Approach 1:
The patent combines multiple LED pixels into a single integrated package, where multiple LED chips are mounted on a common substrate with shared electrical connections. This merging approach reduces the total number of interconnects needed compared to using separate single-pixel packages, while still allowing independent control of each pixel through the integrated structure.
2Ease of operation
If single pixel LED packages are used, then assembly flexibility is maintained, but material and handling costs increase
Solution Approach 1:
Multiple LED pixels are integrated into a single package with shared substrates, encapsulants, and electrical interconnect structures. This consolidation reduces the total quantity of materials required per pixel compared to individual packaging, while the modular package design maintains assembly flexibility for display manufacturing.
Solution Approach 2:
The integrated package structure serves multiple functions simultaneously: the substrate provides mechanical support for multiple LEDs, the encapsulant protects all pixels environmentally, and the lead frame provides electrical connections to multiple pixels. This multi-functionality reduces material requirements while maintaining assembly ease.
3Manufacturing precision
If multiple pixel LED packages are developed, then pitch between pixels is reduced and resolution increases, but the package structure becomes more complex
Solution Approach 1:
The patent divides the integrated package into distinct pixel regions with individual LED chips, mounting areas, and electrical connection zones. This segmentation allows for reduced pitch between pixels through systematic layout optimization, while maintaining manageable package structure complexity through modular design elements that can be replicated across multiple pixels.
Data Source
AI summary
Emitter panels and displays utilizing solid state packages and methods for fabricating the same are disclosed. One emitter panel comprises a raised barrier on a submount defining a plurality of cavities, each cavity having at least one LED in a pixel area. The panel is capable of receiving electrical signals for independently controlling the emission from the emitters. Solid state displays utilize the emitter panels mounted in relation to one another to generate a message or image. The panels comprise multiple pixels each having at least one light emitter, with each panel capable of receiving electrical signals for independently controlling the emission of at the pixels.