Wave Soldering Tank Oxidation Prevention

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Solution Overview

Problem

Conventional wave soldering tanks face issues with oxide formation around the rotating shaft of the discharge pump, leading to poor solder quality, maintenance challenges, and equipment damage due to thermal expansion and contraction, as well as inefficient oxide removal and spattering during maintenance.

Innovation Solution

A wave soldering tank design featuring an oxidation preventing member made of materials like stainless steel or titanium alloys, with a hollow interior to float on the molten solder and a cylindrical member surrounding the rotating shaft to prevent oxide formation, combined with a screw pump with four helical blades to minimize eddy flow and pulsation, ensuring smooth operation and easy maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a screw pump is used to eliminate pulsation of molten solder, then the smoothness of solder flow is improved, but oxides develop in the periphery of the rotating shaft due to swirling and contact with air

Engineering Contradiction:
Improvesmoothness of solder flowVSAvoidoxide formation
Core Design Contradiction:
Stability of the object's compositionVSObject-generated harmful factors

Solution Approach 1:

A shaft seal member is introduced as an intermediary component between the rotating shaft and the molten solder. This seal member prevents direct contact between the rotating shaft and molten solder, thereby eliminating the source of oxide generation while preserving the screw pump's ability to deliver smooth solder flow without pulsation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the rotating shaft rotates while immersed in molten solder to pump solder, then pumping function is achieved, but oxides develop due to rubbing by the rotating shaft

Engineering Contradiction:
Improvepumping functionVSAvoidoxide formation
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The shaft seal member serves as a mediator that allows the rotating shaft to perform its pumping function while preventing direct contact with molten solder. The seal member is rotated by the rotating shaft through magnetic coupling, maintaining the pumping action without the shaft itself contacting the solder and generating oxides

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-generated harmful factors

If a shaft seal member is introduced to prevent oxide formation, then oxide generation is eliminated, but the structure becomes more complex

Engineering Contradiction:
Improveoxide formationVSAvoidstructure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

Traditional mechanical sealing methods involving direct contact between the rotating shaft and seal components are replaced with a magnetic coupling system. The magnetic coupling transmits rotational force without physical contact, eliminating wear and oxide generation while simplifying the overall sealing structure compared to conventional mechanical seals

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses oxide formation, maintains consistent solder spouting height, prevents equipment damage, and simplifies maintenance by allowing safe and efficient removal of the oxidation preventing member, ensuring stable long-term operation and improved solder quality.

Implementation Method 1

an oxidation preventing member (22) which is installed so as to float atop the surface of the molten solder (S)

Methodology Applied
Scientific EffectBuoyancy: Archimedes' Principle (Buoyancy)

Implementation Method 2

a screw pump with four helical blades to minimize eddy flow and pulsation

Methodology Applied
Scientific EffectHelical transport: Archimedes Screw

Data Source

PatentEP2012570B1Jet solder tank
Publication Date: 2011.10.19 SENJU METAL IND CO LTD
  • EP2012570B1 patent drawingFigure 1
  • EP2012570B1 patent drawingFigure 2
  • EP2012570B1 patent drawingFigure 3

AI summary

A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tank 1 has a tank body 1a which houses molten solder S, a discharge pump 5 which pumps molten solder S, a discharge nozzle 4 which spouts molten solder S which was sent to it by the discharge pump 5 upwards, a duct 2 having the discharge pump 5 installed at one of its ends and the discharge nozzle 4 installed at its other end, an oxidation preventing member 22 which has a prescribed size and which floats on the surface of the molten solder S, and an engaging means 13 which controls rotation of the oxidation preventing member 22 in a horizontal plane. The oxidation preventing member 22 has a surrounding member 28 which extends downwards at its center and which surrounds the rotating shaft 10 with a gap between it and the rotating shaft 10, and a hollow space 26 in its interior for providing buoyancy.