Force Sensor Patch Assembly in Earphone PCB
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Solution Overview
Problem
Conventional methods for assembling sensor circuits in electronic devices, such as earphones, require additional retention components that occupy significant internal space and complicate the assembly process.
Innovation Solution
The integration of a thin film force sensor patch directly onto specific electrodes of a printed circuit board within the earphone device, allowing for detection of user pressure and simplifying the assembly by eliminating the need for additional retention components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional retention assembly component is used to keep the sensor circuit in place, then the sensor circuit location is secured, but the internal circuit space is occupied and the assembly procedure becomes complicated
Solution Approach 1:
The patent combines the retention function with the sensor circuit itself by designing the sensor circuit to be directly integrated onto the printed circuit board (PCB) using conductive adhesive. This eliminates the need for separate retention assembly components, thereby securing the sensor circuit location while preserving internal circuit space.
Solution Approach 2:
The conductive adhesive serves multiple functions: it provides electrical connection between the sensor circuit and PCB, and simultaneously acts as a retention mechanism to secure the sensor circuit in place. This multi-functionality eliminates the need for additional retention components.
2Reliability
If an additional retention assembly component is used to keep the sensor circuit in place, then the sensor circuit location is secured, but the assembly procedure becomes complicated
Solution Approach 1:
The patent merges the retention function with the sensor circuit assembly process itself. The sensor circuit is directly assembled onto the PCB using conductive adhesive in a single step, eliminating the need for separate retention component installation and simplifying the assembly procedure.
Solution Approach 2:
The patent extracts the retention function from separate components and integrates it directly into the sensor circuit assembly process. By using conductive adhesive that provides both electrical connection and mechanical retention, the complex multi-step assembly involving separate retention components is eliminated.
3Reliability
If a conventional larger sensor circuit is used, then the sensing function is achieved, but additional retention components are required occupying internal space
Solution Approach 1:
The patent employs a thin-film sensor circuit design that can be directly assembled onto the PCB surface. This thin-film approach eliminates the need for bulky conventional sensor circuits and their associated retention structures, thereby achieving the sensing function while minimizing internal circuit space occupation.
Data Source
AI summary
An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.