Circuit Board Conductor Pattern Examination Before Component Attachment
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Solution Overview
Problem
Current methods for manufacturing circuit-board structures with embedded components lack efficiency in pre-examining conductor patterns before component attachment, leading to potential losses if patterning fails, and do not allow for optimal examination or alignment of vias for electrical contacts.
Innovation Solution
A method involving creating conductor patterns and contact openings on a circuit-board blank, followed by the alignment and attachment of components, where contact openings are made to facilitate electrical connections between the conductor pattern and components, allowing for pre-examination of patterns and alignment of vias for improved contact quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are attached to conductor patterns after patterning, then electrical connections are established, but conductor patterns cannot be examined before attachment leading to potential losses if patterning fails
Solution Approach 1:
The patent applies preliminary action by creating and examining conductor patterns on a separate carrier substrate before attaching components. This allows optical examination of the conductor patterns to verify quality and detect defects before the critical component attachment step, preventing loss of expensive components due to patterning failures.
Solution Approach 2:
The manufacturing process is segmented into distinct stages: conductor pattern creation on carrier, examination of patterns, component attachment, and final assembly. This segmentation allows independent verification of conductor pattern quality before proceeding to component attachment, resolving the contradiction between ensuring reliability and avoiding time/component loss.
2Manufacturing precision
If components are attached directly to conductor patterns, then electrical connections are made, but alignment of vias for electrical contacts cannot be optimized
Solution Approach 1:
The patent introduces a carrier substrate as an intermediary element that holds the conductor patterns during the examination and attachment processes. This intermediary allows for precise alignment of vias and contact openings relative to the conductor patterns, enabling optimized via alignment precision while managing manufacturing complexity through a structured intermediate platform.
3Measurement precision
If conductor patterns are examined after component attachment, then all layers are complete, but examination opportunities are lost and rework becomes difficult
Solution Approach 1:
The patent performs conductor pattern examination as a preliminary action before component attachment and final assembly. By examining the conductor patterns on the carrier substrate at this intermediate stage, the process enables high-quality measurement and verification of conductor patterns while maintaining ease of manufacture, as corrections can still be made before components are permanently attached.
Data Source
AI summary
This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).