Polymeric Grounding Bond for Circuit Board EMI Shielding
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Solution Overview
Problem
Existing methods for forming ground bonds between components, such as printed circuit boards, are time-consuming, prone to failure, and offer little electromagnetic interference shielding, making them inadequate for reliable connectivity and interference protection.
Innovation Solution
A grounding arrangement involving a first circuit board with a ground plane, a flange member, and a polymeric member with an electrically conductive coating that forms a conductive bond between the ground planes and the flange member, eliminating the need for soldering and providing electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soldered connection is used to electrically couple ground planes of separate circuit boards, then electrical grounding is achieved, but the process is time-consuming and difficult to achieve
Solution Approach 1:
The patent replaces the mechanical soldering process with a press-fit connection system. The press-fit member engages with both circuit boards through mechanical insertion and friction fit, eliminating the need for soldering. This substitution reduces assembly time and complexity while maintaining reliable electrical grounding through the conductive press-fit member that mechanically and electrically connects the ground planes.
Solution Approach 2:
The patent introduces a press-fit member as an intermediary component between the two circuit boards. This intermediary element simplifies the grounding process by providing a single component that simultaneously connects to both circuit boards, eliminating the need for direct soldering between boards and reducing assembly complexity and time.
2Reliability
If a soldered connection is used to electrically couple ground planes of separate circuit boards, then electrical grounding is achieved, but the connection is prone to future failure
Solution Approach 1:
The patent replaces the vulnerable soldered joint with a mechanically robust press-fit connection. The press-fit member provides a physical interference fit that is less susceptible to thermal stress, creep, and degradation over time. This mechanical connection system enhances long-term reliability by eliminating the weaknesses of solder joints while maintaining ease of assembly through simple insertion and engagement.
3Reliability
If a soldered connection is used to electrically couple ground planes of separate circuit boards, then electrical grounding is achieved, but electromagnetic interference shielding is insufficient
Solution Approach 1:
The patent merges the grounding function with the shielding function into a single integrated solution. The press-fit member serves dual purposes: it provides electrical grounding by connecting ground planes, and it provides electromagnetic interference shielding by creating a continuous conductive path that blocks EMI. This consolidation eliminates the need for separate shielding components while maintaining both grounding and EMI protection functions.
4Object-affected harmful factors
If separate electromagnetic interference shields are used, then EMI protection is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (grounding and EMI shielding) into a single integrated component - the press-fit member. This eliminates the need for separate shielding elements and reduces overall device complexity. The press-fit member's conductive material and geometric design simultaneously provide electrical connection and EMI blocking, simplifying the overall assembly while maintaining protection.
Solution Approach 2:
The press-fit member is designed as a multi-functional component that performs both grounding and EMI shielding. This universal element replaces what would traditionally require separate components, reducing part count, assembly steps, and overall system complexity while maintaining both electrical grounding and electromagnetic interference protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and reliable electrical bonding between components while reducing electromagnetic interference, enhancing the stability and functionality of human machine interfaces and other applications.
Implementation Method 1
a polymeric member including an electrically conductive coating. The polymeric member forms an electrically conductive bond between the first ground plane, the flange member, and the second ground plane
Implementation Method 2
it is also a potential source for future failure of the ground bound. In addition, utilizing a soldered connection to electrically couple ground planes of separate circuit boards provides little to no shielding of the circuit boards from electromagnetic interference
Data Source
AI summary
Techniques and arrangements for forming ground bonds between a plurality of components are provided. In one form, a grounding arrangement includes a first circuit board including a first ground plane and a flange member electrically coupled to the first ground plane. The arrangement also includes a second circuit board including a second ground plane, and a polymeric member including an electrically conductive coating. The polymeric member forms a bond between the first ground plane, the flange member, and the second ground plane. In one particular but non-limiting aspect of this form, the grounding arrangement is utilized in a human machine interface having a liquid crystal display. Further embodiments, forms, objects, features, advantages, aspects, and benefits shall become apparent from the description and drawings.