Interchangeable Work Unit Head for Versatile Component Mounting
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Solution Overview
Problem
Current component mounting technologies face challenges in achieving versatility and high productivity, particularly in handling a wide range of component types with varying mounting requirements, such as semiconductor chips, due to limitations in adaptability and precision.
Innovation Solution
A component mounting apparatus and method featuring a dual-head system with a first head for loading components and a second head equipped with interchangeable work units, including paste coating, transfer, and heating-press functions, allowing for flexible operation to accommodate different mounting modes and enhance versatility and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a component mounting apparatus is equipped with multiple specialized functions for different mounting modes, then the mounting precision and reliability for specific component types is improved, but the device complexity and footprint increase
Solution Approach 1:
The patent implements a single head that can perform multiple functions by selectively attaching different work units. The head can switch between component pickup, paste coating, and heating-press operations, eliminating the need for separate specialized heads for each function while maintaining mounting precision for different component types
2Reliability
If separate apparatuses are used for different mounting modes, then the mounting reliability for each mode is ensured, but the number of facilities and footprint increase
Solution Approach 1:
The patent merges multiple mounting functions (pickup, paste coating, heating-press) into a single integrated apparatus. The head can selectively perform different operations based on component type, consolidating what would traditionally require separate facilities into one compact system
3Adaptability or versatility
If a single apparatus handles multiple component types, then the versatility is improved, but the adaptability to specific mounting requirements decreases
Solution Approach 1:
The patent employs a dynamic configuration where the head can selectively attach and detach different work units based on the component type being processed. This dynamic adaptability allows the single apparatus to maintain high mounting accuracy for each specific component type while handling diverse mounting requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus can efficiently handle multiple component types by selectively using work units for bonding, transferring, and heating, thereby improving adaptability and production efficiency while minimizing equipment footprint.
Implementation Method 1
a heating-press function for pressing the component loaded on the substrate against the substrate while heating the component
Implementation Method 2
a paste coating function for squirting paste for component bonding from a coating nozzle so as to supply the paste to the substrate
Data Source
AI summary
A component mounting method for mounting a plurality of types of components on a substrate is disclosed. The mounting method includes providing a component mounting apparatus 1 for mounting a semiconductor chip 6a picked from a component feeding stage 3 to a substrate 7, having a paste coating unit 20 for squirting paste from an associated coating nozzle to apply the paste to the substrate 7, a paste transfer unit 54 for transferring paste by an associated transfer tool to the substrate 7, and a heating-press unit 57 for pressing the component loaded on the substrate 7 against the substrate 7 while heating the component. The mounting method also includes selecting a work unit from the paste coating unit 20, the paste transfer unit 54 and the heating-press unit 57, and equipping a second head 12 with the selected work unit.