Chip Electronic Component with Interposer Recesses for Acoustic Noise Reduction
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Solution Overview
Problem
Multilayer ceramic capacitors experience deformation due to piezoelectric phenomena when DC or AC voltages are applied, causing acoustic noise in printed circuit boards, which leads to listener discomfort.
Innovation Solution
A chip electronic component with an interposer having terminal electrodes and recesses is used, where the external electrodes are formed on the side portions of the ceramic body instead of the end portions, and the interposer is electrically connected to the external electrodes, reducing the transfer of vibration-induced noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If external electrodes are formed on end portions of the ceramic body, then electrical connectivity is achieved, but acoustic noise is generated due to piezoelectric deformation
Solution Approach 1:
An interposer is introduced as an intermediary component between the ceramic body and the printed circuit board. The interposer includes terminal electrodes that are electrically connected to external electrodes formed on the side portions of the ceramic body, rather than end portions. This intermediary structure transmits electrical signals while isolating the piezoelectric deformation from the PCB, thereby reducing acoustic noise while maintaining electrical connectivity.
Solution Approach 2:
The external electrodes are repositioned from the end portions (length direction) to the side portions (width direction) of the ceramic body. This dimensional change in electrode placement alters the deformation pattern, causing the ceramic body to expand and contract in the width direction rather than the length direction, which reduces the transmission of vibration to the PCB and minimizes acoustic noise.
2Stability of the object's composition
If the ceramic body is rigidly fixed to the PCB, then mechanical stability is improved, but vibration-induced noise is transferred to the board
Solution Approach 1:
The interposer serves as a mediator between the ceramic body and the PCB, providing electrical connection through terminal electrodes while mechanically isolating the ceramic body from the PCB. This intermediary structure allows the ceramic body to remain mechanically stable during operation while preventing the direct transfer of piezoelectric vibration to the PCB, thereby reducing acoustic noise.
Solution Approach 2:
The electrical connection path is segmented from the mechanical connection path. The interposer divides the system into distinct functional zones: the ceramic body with external electrodes on side portions, the interposer with terminal electrodes for electrical connection, and the PCB with land patterns. This segmentation allows electrical connectivity to be maintained while mechanical vibration is isolated, resolving the contradiction between stability and noise transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly decreases acoustic noise by minimizing the displacement of the ceramic body and enhancing adhesion strength, while maintaining effective electrical connectivity.
Implementation Method 1
an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes provided on both side portions thereof and recesses provided inwardly in the first and second terminal electrodes
Data Source
AI summary
There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.