Solder Mesh Reinforced Adhesive Bonding for Peel Fracture Resistance
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Solution Overview
Problem
Existing adhesive bonding technologies face challenges in achieving uniform bond line thickness and promoting fracture propagation along a path requiring the greatest amount of fracture energy, leading to suboptimal joint strength and vulnerability to peel fractures.
Innovation Solution
Incorporating a solder mesh within the adhesive, which contacts at least one substrate surface and is designed to arrest or deflect crack propagation, promoting shear fracture by facilitating a fracture path that requires more energy, thereby enhancing bond line uniformity and joint strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If glass beads are added to structural adhesives to ensure bond line uniformity, then bond line thickness control is improved, but adhesive joint strength deteriorates because glass beads do not bond to substrate materials
Solution Approach 1:
The patent changes the material parameter of the reinforcement element from non-bonding glass beads to bonding-capable solder particles, droplets, or mesh. This material substitution maintains the uniformity function while adding bonding capability to substrate surfaces, thereby resolving the strength deterioration issue.
Solution Approach 2:
The patent creates a composite system combining structural adhesive with solder reinforcement elements (particles, droplets, or mesh). This composite approach integrates the uniformity-providing function of dispersed elements with the bonding function of solder material that adheres to substrates, simultaneously achieving both bond line uniformity and enhanced joint strength.
2Reliability
If structural adhesives are used to replace welds and mechanical fasteners, then fatigue and failure resistance is improved, but fracture propagation control deteriorates leading to peel fractures
Solution Approach 1:
The solder reinforcement elements act as intermediary structures within the adhesive bond line. When fracture occurs, these elements serve as crack arrestors or deflectors, forcing the fracture path to deviate from the direct peel path and requiring additional energy to propagate through the solder-substrate interface, thereby improving fracture resistance.
Solution Approach 2:
The patent segments the continuous adhesive bond line by incorporating discrete solder reinforcement elements (particles, droplets, or mesh). This segmentation creates multiple potential crack arrest points and forces fracture to navigate around or through these segmented elements, increasing the energy required for fracture propagation and reducing vulnerability to peel fractures.
3Strength
If solder mesh is positioned in adhesive to promote shear fracture, then fracture energy requirement is improved, but device complexity increases
Solution Approach 1:
The patent employs relatively simple, inexpensive solder reinforcement elements (particles, droplets, or mesh) that can be easily incorporated into the adhesive application process. These simple elements provide significant fracture energy enhancement without requiring complex bonding system infrastructure, thereby improving fracture resistance while minimizing added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solder mesh system achieves improved bond line uniformity and increased fracture resistance, requiring more energy for crack propagation, resulting in enhanced tensile and shear strength and reduced risk of peel fractures.
Implementation Method 1
the solder mesh is positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the system, a greatest amount of fracture energy
Implementation Method 2
applying heat to the first contact surface such that at least one portion of the solder mesh reaches a solder-bonding temperature
Implementation Method 3
applying heat to the first contact surface such that at least one portion of the solder mesh reaches a solder-bonding temperature
Data Source
AI summary
The present disclosure relates to a bonding system (100) comprising an adhesive (200), in contact with a first contact surface (115) and a second contact surface (125), and a solder mesh (310) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200), positioning, at least partially into the adhesive (200), a solder mesh (310), such that the solder mesh (310) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that at least one portion of the solder mesh (310) reaches a solder-bonding temperature.