PCB Damper Material for Capacitor Noise Reduction

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing solutions for mitigating the 'singing capacitor' issue in printed circuit board assemblies, such as using long lead wires, double-sided PCB designs, or stiffeners, are either costly, space-consuming, or increase power consumption, failing to effectively reduce noise generation without significant drawbacks.

Innovation Solution

A printed circuit board assembly (PCBA) that incorporates a damper material, typically an elastomeric silicone-based polymer, coupled to the PCB to dissipate kinetic energy generated by capacitors during operation, thereby reducing vibration and noise without increasing component height, cost, or power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If long lead wires are used to isolate the capacitor from the PCB, then the capacitor is supported out of contact with the PCB, but the device height increases and manufacturing complexity increases

Engineering Contradiction:

Improvenoise generationVSAvoiddevice height

Core Design Contradiction:

Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

A dampening material is introduced as an intermediary between the capacitor and the PCB. This material directly contacts both the capacitor and the PCB, providing vibration isolation and noise reduction without requiring long lead wires. The dampening material absorbs mechanical vibrations while maintaining electrical isolation, thus reducing noise generation without increasing device height.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If capacitors are placed on opposite sides of the PCB, then vibrations cancel out, but the device complexity and manufacturing cost increase

Engineering Contradiction:

Improvenoise generationVSAvoidPCB design complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The vibration cancellation function is extracted from the PCB structure itself and transferred to a dedicated dampening material. Instead of relying on the complex double-sided capacitor arrangement, the dampening material is placed between the capacitor and PCB to independently handle vibration isolation, simplifying the overall device design while maintaining noise reduction effectiveness.

Inventive Principle:

Principle #2Taking out (Extraction)

3Object-affected harmful factors

If stiffeners are added to the PCB near the capacitor, then PCB rigidity increases, but manufacturing cost and device weight increase

Engineering Contradiction:

Improvenoise generationVSAvoidPCB weight

Core Design Contradiction:

Object-affected harmful factorsVSWeight of stationary object

Solution Approach 1:

The mechanical stiffening approach is replaced with a vibration dampening approach. Instead of adding rigid stiffeners to increase PCB rigidity, a dampening material is used to absorb vibrations directly at the capacitor interface. This substitution reduces the need for additional structural support while effectively reducing noise generation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Object-affected harmful factors

If the slew rate is slowed to address voltage delivered to the capacitor, then capacitor deformation and noise generation are reduced, but power consumption increases

Engineering Contradiction:

Improvenoise generationVSAvoidpower consumption

Core Design Contradiction:

Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

A dampening material is introduced as a mechanical intermediary between the capacitor and the PCB to address vibration-induced noise. This approach targets the mechanical vibration pathway separately from the electrical signal pathway, allowing the capacitor to operate at its optimal slew rate without compromising noise reduction. The dampening material absorbs mechanical energy while the electrical system maintains efficient operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The damper material effectively minimizes acoustic noise by absorbing and dissipating kinetic energy, providing structural damping and thermal conductivity while maintaining electrical insulation, thus addressing the limitations of prior approaches.

Implementation Method 1

a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation

Methodology Applied

Scientific EffectKinetic energy dissipation: Viscous Damping

Implementation Method 2

providing structural damping

Methodology Applied

Scientific EffectStructural damping: Damping

Implementation Method 3

providing structural damping and thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

maintaining electrical insulation

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Data Source

PatentUS11140770B2Printed circuit board assembly

Publication Date: 2021.10.05 INTEL CORP

AI summary

Printed circuit board assembly (PCBA) technology is disclosed. A PCBA can include a printed circuit board (PCB). The PCBA can also include a capacitor operably mounted on a side of the PCB. In addition, the PCBA can include a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation. An electronic system including a capacitor and damping material, and a method for minimizing acoustic vibration in an electronic system are also disclosed.