Additive PCB Fabrication Using Sacrificial Layers
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Solution Overview
Problem
Current methods for manufacturing printed circuit boards (PCBs) are costly, time-consuming, and involve hazardous materials, making them unsuitable for rapid prototyping and environmentally friendly applications, especially when used in underwater sensing due to the use of toxic chemicals and expensive equipment.
Innovation Solution
The method employs additive manufacturing to create a trace layer, sacrificial layer, rail layer, and lid using non-toxic materials like plastic and liquid metal, allowing for the reuse of sacrificial layers and reducing waste, with a 3D printer and filaments, enabling in-house production of PCBs at lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical milling and chemical etching are used to fabricate PCBs, then circuit traces can be formed with proper width and precision, but the process becomes time-consuming, costly, and involves hazardous materials
Solution Approach 1:
The patent inverts the traditional subtractive manufacturing approach by using additive manufacturing to build up circuit traces layer by layer. Instead of removing material to create traces, the invention deposits conductive material only where needed through 3D printing, dramatically reducing fabrication time while maintaining precision through controlled deposition processes
Solution Approach 2:
The invention changes the manufacturing parameter from mechanical removal (milling) or chemical dissolution (etching) to controlled material deposition. This parameter change enables rapid prototyping while maintaining trace precision through digital control of the deposition process, eliminating the need for time-consuming iterative adjustments
2Reliability
If traditional PCB manufacturing methods are used, then reliable circuit boards can be produced, but toxic chemicals and hazardous materials are involved posing safety threats
Solution Approach 1:
The patent extracts and eliminates the hazardous chemical processes from PCB manufacturing. By replacing wet chemical etching with additive manufacturing using non-toxic conductive inks or pastes, the invention removes the source of toxic exposure while maintaining circuit reliability through precise material placement and controlled deposition
Solution Approach 2:
The invention uses disposable, non-toxic consumables such as standard 3D printing filaments and safe conductive inks instead of expensive, hazardous chemicals. These materials can be easily replaced without special handling requirements, improving safety while maintaining manufacturing reliability through consistent material properties
3Manufacturing precision
If expensive specialized equipment like laser cutters and milling machines are used, then precise circuit boards can be manufactured, but the cost increases significantly
Solution Approach 1:
The patent employs a universal 3D printing platform that can manufacture both the structural substrate and the conductive traces in a single integrated process. This multi-functional approach eliminates the need for separate expensive equipment like laser cutters, milling machines, and plating lines, significantly reducing capital investment while maintaining precision through digital design control
Solution Approach 2:
The invention uses digital 3D models to directly guide the manufacturing process, creating a digital copy of the final circuit board design that is then physically reproduced layer by layer. This digital copying approach eliminates the need for expensive physical tooling and fixtures, allowing precise reproduction of circuit patterns at low cost through software-controlled deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in cost-effective, rapid, and environmentally friendly PCB production, suitable for various applications, including underwater use, with reduced material waste and the ability to recycle components, while ensuring safety and efficiency in the manufacturing process.
Implementation Method 1
melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections between the electrical components and the conductive material
Implementation Method 2
depositing a conductive material on top of the sacrificial layer and the plurality of traces of the trace layer
Data Source
AI summary
Methods, systems, and apparatus for fabricating a circuit board. The method includes fabricating, using an additive manufacturing device, a trace layer, a sacrificial layer, a rail layer and a lid. The method includes placing the sacrificial layer on the trace layer such that the raised traces protrude through corresponding openings of the sacrificial layer. The method includes depositing a conductive material on top of the sacrificial layer and the plurality of traces. The method includes removing the sacrificial layer from the trace layer and placing the rail layer on the trace layer such that the raised traces align with the corresponding openings of the rail layer. The method includes connecting one or more electrical components and melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections and to provide protection. The method includes placing the lid on top of the sealing sheet.