Insulating Substrate Metal Adhesion Improvement TRIZ Cases

A low dielectric polyimide composition uses aliphatic anhydrides and ester diamines to reduce polarizability.

A conductor pattern features a rougher adhesive surface to bond securely with an insulating substrate.

Electrodeposited copper foil achieves low profile and high gloss through controlled electrolytic deposition.

A printed circuit board base material features a sintered metal layer partially embedded into an insulating film to ensure strong adhesion.

A ceramic circuit substrate uses a line pattern of brazing material along the edge to create a gap between the metal plate and the ceramic base.

Polymer carboxylic groups adsorb metal ions at basic pH, enabling thin metal layers that reduce etching waste and improve signal integrity.

A printed wiring board uses a multi-layer seed structure to enhance adhesion between conductors and insulating layers.

A surface treated copper foil with a Ni-Zn alloy layer deposits on untreated copper to bond polyimide films.

A 3D printing method builds circuit traces using sacrificial layers and conductive inks for rapid prototyping.

Thermal pressing of semi-cured silicon-based polymer compounds reduces thermal resistance and enhances bonding strength in printed circuit boards.

Surface roughness exceeding 0.3 μm prevents unwanted diffusion connections at non-brazed contact points.

A coating film-forming composition containing aromatic compounds and polybasic acids deposits on metal surfaces to improve resin adhesion.

Dynamic curing of selective adhesion blanks reduces lead times and production costs for varied PCB designs.

Plating a shrink layer on a core body bypasses photolithographic limits, enabling narrower linewidths and pitches for flexible substrates.

A transparent circuit board uses conductive wiring embedded in a transparent insulating layer to reduce line width while maintaining current capacity.

A wiring substrate increases corner cross-sectional area via a thickness gradient to resolve bonding strength reduction caused by sudden thickness changes.

A copper foil featuring a primary particle layer and secondary ternary alloy layer bonds to liquid crystal polymer substrates.

Replacing liquid epoxy with a pre-formed insulating resin sheet prevents pinhole formation in the dielectric layer, maintaining withstand voltage reliability.

A flexible multilayered construction encapsulates conductive traces within inner and outer layers to distribute mechanical stress at through-holes.

Selective surface roughening improves epoxy molding compound adhesion while preserving solderability and wire bondability in harsh thermal environments.

A primer layer enhances adhesion between polymer layers in flexible circuit electrode arrays, preventing delamination during curvature to match the retina.

A long-chain alkyl bismaleimide resin film achieves strong adhesion and low dielectric properties through thermal curing.

Doped copper and aluminum alloy layers radiate heat while minimizing thermal expansion mismatch to prevent insulating substrate cracking.

A fluorinated resin adhesive film with functional groups directly laminated on polyimide.

A circuit board uses a glass layer between metal wiring and ceramic to maintain adhesion strength during thermal cycling.

Segmented bonding with a perforated carrier prevents residue and bubbles, eliminating costly separation layers.

Tungstate electrolyte deposits uniform copper on the adhesion surface to boost peeling strength while eliminating toxic powder dropping.

Non-etching protector solution increases copper adhesion strength while maintaining surface integrity for fine line PCBs.

Controlled silicon and nitrogen adhesion resolves the trade-off between conductor loss and peel strength in high-frequency flexible printed circuits.

A flexible circuit electrode array uses a top metal adhesion layer to bond polymer insulators.

A copper-clad laminate uses a composite adhesive layer to reduce dielectric loss tangent at high frequencies.

Optimized permanganate and alkali metal hydroxide concentrations remove smear while controlling surface roughness to prevent excessive etching.

A copper foil uses a primary particle layer and secondary ternary alloy coating to enhance bonding strength.