PCB Base Material with Embedded Sintered Metal Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional base materials for printed circuit boards require expensive vacuum equipment for sputtering, and there is a need for improved adhesion between the base film and the sintered body layer, especially for flexible printed circuit boards to prevent peeling under bending stress.
Innovation Solution
A base material with a sintered body layer of metal particles partially embedded into an insulating base film, where the embedment ratio of the sintered particles is between 10% and 90%, and plasma treatment is applied to enhance adhesion, allowing for high peel strength and flexibility without the need for expensive vacuum equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If sputtering method is used to form seed layer, then adhesion between base film and metal layer is improved, but manufacturing cost increases due to expensive vacuum equipment
Solution Approach 1:
The patent replaces the sputtering method (physical vapor deposition using vacuum equipment) with a sintering process that uses a simple heating apparatus. Metal particles are sintered on the base film surface through heating, eliminating the need for expensive vacuum equipment while forming a conductive layer with sufficient adhesion for flexible printed circuit boards
Solution Approach 2:
The patent changes the processing parameters from low-temperature sputtering in vacuum to high-temperature sintering in atmospheric conditions. By controlling the sintering temperature and metal particle characteristics, the process achieves adequate adhesion strength without requiring vacuum equipment, thus reducing manufacturing costs
2Ease of manufacture
If sintered body layer is formed without embedding, then manufacturing process is simplified, but adhesion under bending stress deteriorates
Solution Approach 1:
The patent performs preliminary embedding of metal particles into the base film surface before the sintering process. This preliminary action creates mechanical interlocking between the base film and the sintered body layer, ensuring adequate adhesion under bending stress while keeping the overall process relatively simple
Solution Approach 2:
The patent creates a composite structure where metal particles are embedded in the base film and then sintered to form a sintered body layer. This composite approach combines the mechanical interlocking of embedded particles with the conductive network of sintered metal, achieving both adhesion and electrical conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent adhesion between the base film and the sintered body layer, minimizing peeling when bending stress is applied, and reduces manufacturing costs by eliminating the need for expensive vacuum deposition methods.
Implementation Method 1
a step of applying plasma treatment to a surface of the sintered body layer after the step of layering. The sintered body layer includes sintered particles formed by sintering metal particles. In the step of applying the plasma treatment, the sintered particles derived from the metal particles are partially embedded into the surface of the base film
Implementation Method 2
The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film
Data Source
AI summary
A base material for a printed circuit board includes a base film having an insulating property, and a sintered body layer including metal particles and layered on at least one surface of the base film. The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film. The embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%.