Silicon-Based Polymer Insulating Layer for PCB Thermal Management
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Solution Overview
Problem
Conventional printed circuit boards with thick insulating plastic films hinder heat conduction and compactness due to reduced thickness, leading to potential failures and malfunctions in electronic products.
Innovation Solution
A manufacturing method using a silicon-based polymer compound as an insulating material, which is semi-cured and then thermally pressed to form a thin, strong insulating layer between a substrate and a metal sheet, enhancing bonding strength and heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick insulating plastic film is used to bond the substrate and metal sheet, then the bonding strength is sufficient, but the heat conduction rate decreases and the printed circuit board thickness increases
Solution Approach 1:
The patent changes the material parameters by replacing conventional insulating plastic films with silicon-based polymer compounds that have superior thermal conductivity properties. This material substitution enables achieving both high bonding strength and high heat conduction rate simultaneously, resolving the contradiction between bonding strength and heat conduction performance
Solution Approach 2:
The patent employs composite material structure by combining silicon-based polymer compounds with metal particles or other fillers to create an insulating layer that possesses both adequate electrical insulation and enhanced thermal conductivity. This composite approach allows the insulating layer to maintain bonding strength while improving heat conduction rate
2Strength
If a thick insulating plastic film is used, then the bonding strength is sufficient, but the printed circuit board cannot be made compact
Solution Approach 1:
The patent changes the physical and chemical parameters of the insulating material by using silicon-based polymer compounds that require much thinner film thickness to achieve the same bonding strength compared to conventional plastic films. This parameter change enables compact PCB design while maintaining adequate bonding strength
Solution Approach 2:
The patent replaces the mechanical bonding mechanism of thick plastic films with a chemical bonding mechanism using silicon-based polymer compounds that form strong chemical bonds between substrate and metal sheet. This substitution allows for thinner insulating layers while maintaining or improving bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a printed circuit board with significantly improved heat conduction rates and bonding strength, reducing thermal resistance and enabling more compact electronic designs while maintaining high dielectric strength.
Implementation Method 1
baking the first substrate and the first metal sheet at a first temperature to remove solvent of the insulating material so that the insulating material is semi-cured; and bonding the semi-cured insulating material of the first substrate and the semi-cured insulating material of the first metal sheet through thermally pressing the semi-cured insulating material at a second temperature to cure the insulating material
Implementation Method 2
baking the first substrate and the first metal sheet at a first temperature to remove solvent of the insulating material
Data Source
AI summary
A print circuit board and a manufacturing method thereof are disclosed. The print circuit board includes a first substrate, a first insulating layer and a metal sheet. The first insulating layer is formed between the first substrate and the metal sheet. The insulating layer includes silicon-based polymer compound. The manufacturing method for the print circuit board includes the following steps: coating a first substrate and a metal sheet with insulating material, placing the first substrate and the metal sheet into a heating device to bake the insulating material on the first substrate and the metal sheet, and bonding the metal sheet onto the first substrate through thermally pressing the baked insulating material. The insulating material includes silicon-based polymer compound.