Double-Sided Metalized Ceramic Substrate Bonding
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Solution Overview
Problem
Existing methods for manufacturing double-sided metallized ceramic substrates through direct-bonding processes are inefficient due to issues like the need for multiple process steps, adherence of metal plates to substrate carriers, incomplete bonding surfaces, and costly bubble removal methods, which hinder mass production and increase costs.
Innovation Solution
A method utilizing a specially structured carrier with multiple contact points and perforated metal plates to facilitate single-process bonding of ceramic substrates to both sides of metal plates, avoiding residue and bubble formation, and allowing for carrier reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If simultaneous bonding of both metal plates to ceramic substrate is performed, then productivity is improved, but the lower metal plate adheres to the substrate carrier causing damage and requiring additional process steps
Solution Approach 1:
The bonding process is segmented into two distinct sequences: first bonding one metal plate to the ceramic substrate, then bonding the second metal plate. This segmentation avoids the adhesion problem that occurs when both plates are bonded simultaneously, as each plate is processed separately with proper carrier management.
Solution Approach 2:
The ceramic substrate is pre-prepared with specific surface treatments and coatings before bonding to ensure optimal bonding conditions for the first metal plate. This preliminary preparation prevents adhesion issues and facilitates clean detachment from the carrier.
2Ease of manufacture
If separation layer is inserted to prevent adhesion, then ease of manufacture is improved, but additional process steps and costs are incurred
Solution Approach 1:
The substrate carrier is designed as a disposable or easily replaceable component with specific surface properties that prevent metal plate adhesion. Rather than using removable separation layers that require application and removal steps, the carrier itself is sacrificed or easily replaced, eliminating the need for separation layer processing while maintaining ease of detachment.
3Strength
If liquid-phase bonding is used to join metal and ceramic, then bonding strength is improved, but incomplete bonding surfaces and bubble formation occur
Solution Approach 1:
The metal plates and ceramic substrate surfaces undergo preliminary cleaning, activation, and coating treatments before bonding to ensure complete surface coverage and eliminate contaminants that would cause bubbles or incomplete bonding. This pre-preparation ensures the liquid-phase bonding material can uniformly bond across the entire surface.
Solution Approach 2:
The bonding process utilizes controlled phase transitions of the bonding material (melting, flowing, and solidifying) to ensure complete surface coverage. The material is applied in a state that allows it to flow and fill all surface irregularities, then transitions to a solid state to create a strong, bubble-free bond across the entire interface.
4Manufacturing precision
If venting lines are created to reduce bubble formation, then manufacturing precision is improved, but thermal and electrical link is reduced and service life is shortened
Solution Approach 1:
Instead of creating venting lines that compromise the bond, the process converts potential harm from bubble formation into benefit by using controlled pressure and temperature cycles during bonding. These cycles actively force out any forming bubbles while maintaining complete surface bonding, thus eliminating bubbles without creating venting lines that would reduce thermal and electrical conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, cost-effective, and complete bonding of metal-ceramic substrates in a single process sequence, preventing residue adherence and bubble formation, thus simplifying the manufacturing process and enhancing thermal and mechanical bonding.
Implementation Method 1
the formation of connections between the metal plate or foil and the ceramic is effected by means of a liquid-phase bond process. For this purpose, use is made of local melting of an intermediate layer applied onto the metal plate, of which the melting point (eutectic) lies below the melting point of the metal and the ceramic.
Implementation Method 2
The known method for the manufacture of these metal-ceramic composites, by means of eutectic bonding, is generally understood as direct-bonding process or Direct Copper Bonding (DCB).
Data Source
AI summary
The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.