High-Density PCB Conductive Patterns via Core-Shrink Plating
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Solution Overview
Problem
Existing flexible printed circuit boards face limitations in increasing the density of conductive patterns due to the dependence on photolithographic techniques, which restrict the linewidth and pitch of the conductive patterns.
Innovation Solution
A printed circuit board with a base film and a conductive pattern that includes a core body formed by subtractive or semi-additive methods, followed by a shrink layer formed through plating on the outer surface, allowing for narrower gap widths and higher density patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithographic technique using resist pattern is employed to form conductive pattern, then the conductive pattern can be formed on flexible substrate, but the linewidth and pitch of conductive pattern are limited by resist pattern dimensions
Solution Approach 1:
The conductive pattern formation process is segmented into two independent stages: first forming a core body pattern (不受 resist 限制), then forming a shrink layer through plating. This segmentation allows the final conductive pattern dimensions to be determined by plating control rather than resist pattern dimensions, enabling higher density.
Solution Approach 2:
The core body is formed in advance as a template structure before the shrink layer is applied. This preliminary action creates a foundation that defines the initial pattern layout, which is then refined by the shrink layer to achieve the final high-density configuration.
2Device complexity
If conventional coil structure with electric wires wound around magnetic materials is used, then the coil can be formed with simple structure, but the size and weight of electronic devices increase
Solution Approach 1:
The magnetic material component is extracted and removed from the traditional coil structure. The coil is reformulated as conductive patterns formed directly on the flexible substrate, eliminating the need for separate magnetic materials and wire winding operations, thereby reducing weight and simplifying structure.
Solution Approach 2:
The mechanical wire-winding process is replaced with a planar pattern formation process using subtractive and plating methods. This substitution transitions from three-dimensional wire assembly to two-dimensional pattern deposition, reducing complexity and weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of printed circuit boards with high-density conductive patterns, suitable for applications like coils, while maintaining regularity and uniformity in electric resistance and dielectric constants, and reducing production costs.
Implementation Method 1
a shrink layer formed by plating on an outer surface of the core body
Data Source
AI summary
A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive pattern formed on at least one of surfaces of the base film, wherein at least a portion of the conductive pattern includes a core body, and a shrink layer formed by plating on an outer surface of the core body. The portion of the conductive pattern preferably has a striped configuration or a spiral configuration. The portion of the conductive pattern preferably has an average circuit gap width of 30 μm or less. The portion of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating is preferably electroplating or electroless plating.