Transparent Circuit Board Wiring with Carbon Black Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current transparent circuit boards face limitations in achieving higher transparency due to design constraints related to line width and current carrying capacity, while maintaining the visual effect and preventing oxidation of conductive wiring.
Innovation Solution
A transparent circuit board design featuring conductive wiring with a carbon black layer and a blackened layer, where the wiring is partially embedded in a transparent insulating layer, reducing line width and increasing thickness, and a nickel plate is used for electroplating to enhance conductivity and production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the line width of conductive wiring is reduced to improve transparency, then the transparency increases, but the current carrying capacity decreases
Solution Approach 1:
The conductive wiring transitions from a planar two-dimensional structure to a three-dimensional structure by increasing thickness and creating protruding segments that extend beyond the insulating layer. This dimensional change allows the wiring to maintain low visual profile (thin in-plane width) while compensating for current capacity through increased vertical dimension and surface area.
Solution Approach 2:
The conductive wiring is constructed as a composite structure combining multiple materials: copper core for electrical conductivity, nickel plate for electroplating and structural integrity, and protective coating layers (blackened layer and carbon black layer) for oxidation resistance. This composite construction enables the thin wiring to achieve both transparency and sufficient current carrying capacity.
2Illumination intensity
If the line width of conductive wiring is reduced to improve transparency, then the transparency increases, but the wiring becomes more susceptible to oxidation
Solution Approach 1:
The copper core is protected from oxidation by surrounding it with oxidation-resistant materials including nickel plate and protective coating layers (blackened layer and carbon black layer). These layers create a protective environment that prevents direct contact between oxygen and the copper, eliminating the harmful oxidation effect while maintaining the thin transparent structure.
Solution Approach 2:
The multi-layer composite structure of copper-nickel-coating provides both electrical conductivity and oxidation resistance. The copper core maintains conductivity, while the outer layers provide environmental protection, enabling the thin wiring to resist oxidation without compromising transparency.
3Reliability
If the thickness of conductive wiring is increased to improve current carrying capacity, then the current carrying capacity increases, but the overall thickness of the circuit board increases
Solution Approach 1:
The wiring utilizes the vertical dimension by protruding from the insulating layer surface, allowing increased effective thickness for current conduction without proportionally increasing the overall board thickness. The protruding segments provide additional current carrying path while maintaining a compact profile.
Solution Approach 2:
The conductive wiring has non-uniform thickness distribution with thicker protruding segments at critical locations and thinner sections elsewhere. This localized thickening provides enhanced current carrying capacity where needed while minimizing the overall thickness impact on the circuit board.
4Productivity
If the surface of conductive wiring is made smooth to improve manufacturing, then the manufacturing efficiency increases, but the bonding force with cover film decreases
Solution Approach 1:
The blackened layer is applied selectively only on portions of the conductive wiring that contact the cover film, while other areas maintain smoother surfaces. This localized surface treatment provides enhanced bonding strength at critical interfaces without compromising manufacturing efficiency across the entire wiring structure.
Solution Approach 2:
The blackened layer serves as a functional coating that provides both bonding enhancement and oxidation protection. This composite approach allows the underlying smooth copper-nickel structure to maintain manufacturing efficiency while the outer coating layer provides the necessary bonding characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances transparency by reducing light reflection, prevents oxidation, allows for higher current carrying capacity without increasing board thickness, and improves bonding and production efficiency.
Implementation Method 1
The whole surface of the conductive wiring 3 of the transparent circuit board made by the present invention of the method for manufacturing the transparent circuit board is covered by the carbon black layer and the blackened layer, which reduces a reflection of light by the conductive wiring, so that a transparency of the transparent circuit board increases.
Implementation Method 2
At the same time, the carbon black layer and the blackened layer may prevent the conductive wiring from being oxidized, thereby ensuring a quality of the conductive wiring.
Implementation Method 3
the use of a nickel plate as the conductive layer may provide a carrier for conducting current when the conductive wiring is formed by electroplating
Implementation Method 4
since the surface roughness of the blackened layer is relatively great, a bonding force between the blackened layer and the cover film is increased
Data Source
AI summary
A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.