Wiring Substrate Corner Thickness Gradient

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Solution Overview

Problem

Existing wiring substrates for semiconductor elements face challenges in ensuring reliable connections across corners due to sudden changes in wiring thickness, which can lead to reduced bonding strength and increased risk of separation.

Innovation Solution

A wiring substrate design where the wiring thickness gradually increases towards the corner, with thicker edges compared to the inner parts on both the main and side-end surfaces, enhancing the connection cross-sectional area and bonding reliability, and using an inclined exposure method for manufacturing to achieve this thickness gradient.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the wiring thickness is uniform across the substrate, then the manufacturing process is simple, but the bonding strength at the corner is reduced due to sudden thickness changes

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidbonding strength at corner

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The wiring thickness is made non-uniform by increasing it specifically at the corner region where bonding is required, while keeping other regions at standard thickness. This local variation in quality allows the corner to have enhanced bonding strength without unnecessarily increasing manufacturing complexity across the entire substrate.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The wiring thickness parameter is changed in the corner region to be greater than in other regions. This parameter modification addresses the bonding strength issue at the corner by creating a thickness gradient that prevents sudden changes and improves mechanical attachment.

Inventive Principle:

Principle #35Parameter changes

2Strength

If the wiring thickness increases at the corner, then the bonding strength is enhanced, but the wiring structure becomes more complex

Engineering Contradiction:

Improvebonding strength at cornerVSAvoidwiring structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The increased wiring thickness is applied only locally at the corner region rather than uniformly across the entire wiring structure. This localized approach enhances bonding strength where needed while minimizing the overall structural complexity and material usage.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves connection reliability by increasing the cross-sectional area at the corner, preventing metallic diffusion and ensuring stable bonding, while maintaining high precision on the main surface and enhanced bonding strength on the side-end surface.

Implementation Method 1

a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge

Methodology Applied

Scientific EffectGradient thickness design:

Implementation Method 2

using an inclined exposure method for manufacturing to achieve this thickness gradient

Methodology Applied

Scientific EffectPhotolithography exposure: Photopolymerisation

Data Source

PatentUS11589457B2Wiring substrate

Publication Date: 2023.02.21 KYOCERA CORP

AI summary

A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.