Selective Adhesion PCB Production via Dynamic Curing
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Solution Overview
Problem
The existing printed circuit board (PCB) production process is inflexible, requiring significant changes and long lead times to modify designs, leading to increased costs and inefficiencies.
Innovation Solution
A system comprising a conveyor mechanism, a curing system, and a computer that uses selective adhesion blanks with a flexible film, a conductive layer, and a curable adhesive, allowing for dynamic feedback and real-time design modifications through optical inspection and automated curing, enabling the production of multiple PCB designs without delays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional PCB production process is used with fixed design, then manufacturing process is simple, but any design changes require major process changes and long lead times
Solution Approach 1:
The PCB production process is segmented into discrete steps: applying the adhesive layer, placing components, and selective curing. This segmentation allows individual steps to be modified independently, enabling design changes without disrupting the entire production process. The adhesive layer itself is segmented into regions that can be selectively cured based on design requirements.
Solution Approach 2:
The system transitions from a static, fixed-design process to a dynamic process where design parameters can be changed during production. The curing system dynamically adjusts which regions of the adhesive layer are activated, allowing real-time design modifications. The conveyor mechanism enables continuous production flow while accommodating design changes.
2Adaptability or versatility
If traditional PCB production process is used with fixed design, then process setup is simple, but design modifications result in increased costs
Solution Approach 1:
The adhesive layer is applied to the entire substrate surface before component placement and curing. This preliminary action creates a ready-state foundation that allows components to be placed and design changes to be made without requiring re-application of adhesive or re-setup of the production line, thereby reducing costs associated with design modifications.
Solution Approach 2:
The curing process applies different treatments to different regions of the adhesive layer based on local requirements. Only the regions where components are actually placed are cured, while other regions remain uncured. This local quality approach minimizes material waste and allows flexible design changes without affecting the entire production batch.
3Adaptability or versatility
If selective adhesion blanks with curable adhesive are used, then design changes can be made during production, but the production process becomes more complex
Solution Approach 1:
The curable adhesive layer serves as an intermediary between component placement and permanent bonding. This intermediary allows components to be placed, inspected, and repositioned before the curing step locks them in place. The adhesive acts as a buffer that enables design modifications without requiring complex re-work systems.
Solution Approach 2:
The system incorporates inspection mechanisms that provide feedback on component placement quality. This feedback allows the system to identify placement errors or design changes needed before the curing step, enabling corrections to be made while the adhesive is still uncured and components are easily repositionable.
4Productivity
If multiple PCB designs are produced sequentially with traditional methods, then each design requires complete process reset, but production efficiency decreases
Solution Approach 1:
The conveyor-based system enables continuous production flow where multiple PCB designs can be produced in sequence without stopping the line. The adhesive application, component placement, and selective curing steps continue continuously, with design changes implemented by modifying the curing pattern rather than resetting the entire process, thereby eliminating delays between designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and cost-effective production of various PCB designs by allowing for immediate changes and corrections during the production process, reducing lead times and production costs.
Implementation Method 1
a curable adhesive, positioned between the flexible film and the conductive layer and configured to selectively bond with the conductive layer when the curable adhesive is cured
Implementation Method 2
The curing system is configured to cure the curable adhesive for each selective adhesion blank
Data Source
AI summary
A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.