Conductor Pattern Surface Roughness for Touch Sensors
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Solution Overview
Problem
Conductor wiring patterns and electromagnetic shielding materials face issues with diffused reflection of light due to the concave-convex shape of conductive particles, and struggle with strong bonding between the conductor material and substrate.
Innovation Solution
A wiring body with a conductor pattern that has a rougher adhesive surface than other surfaces, featuring specific geometric and surface roughness characteristics, and a method involving filling a recessed portion with conductive material, forming a concave-convex shape, introducing an insulating material, and releasing it from a mold to enhance bonding and reduce diffused reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the conductor material is transferred using offset printing and heated to form a conductor wiring pattern, then the conductor pattern is formed on the substrate, but a concave-convex shape is generated on the surface due to conductive particles causing diffused reflection of light
Solution Approach 1:
The invention applies different surface quality requirements to different parts of the conductor pattern. The adhesive surface (contact area with substrate) is maintained with a relatively flat surface to ensure strong bonding, while the non-adhesive surface (facing outward) is allowed to have a concave-convex shape that suppresses diffused reflection. This local differentiation resolves the contradiction between bonding strength and light reflection control.
Solution Approach 2:
Instead of attempting to make the entire conductor pattern surface flat to suppress diffused reflection, the invention inverts the approach by intentionally creating a specific concave-convex shape on the non-adhesive surface. This inverted geometry (with controlled slopes and angles) is designed to control light reflection characteristics while maintaining flatness only where needed for bonding.
2Object-generated harmful factors
If the surface roughness of the entire conductor wiring pattern is reduced to suppress diffused reflection, then light reflection is improved, but strong bonding between the conductor material and substrate becomes difficult
Solution Approach 1:
The invention specifies different surface roughness requirements for different surfaces of the conductor pattern. The adhesive surface is kept relatively flat (lower surface roughness) to ensure strong bonding with the substrate, while the non-adhesive surface is designed with controlled concave-convex features to suppress diffused reflection. This local quality differentiation allows both bonding strength and reflection control to be optimized simultaneously.
3Ease of manufacture
If the conductor pattern is formed by filling intaglio with conductor material and heating, then the wiring pattern is created, but the concave-convex shape from conductive particles causes light diffusion
Solution Approach 1:
The invention controls the parameters of the conductor pattern geometry, specifically the slope angles and depth of the concave-convex features formed by the conductive particles. By optimizing these geometric parameters (slope angles within specific ranges, controlled particle distribution), the invention maintains the ease of manufacturing through conventional offset printing while controlling light diffusion through precise geometric parameter management.
Data Source
AI summary
A wiring body includes an adhesive layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.