Address-Event Imaging Chip Split Architecture for Smaller Pixel Area
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Solution Overview
Problem
The asynchronous type solid-state imaging device has a larger circuit scale than the synchronous type, leading to increased mounting area when the address event detection circuit is arranged for each pixel, which is a challenge in applications requiring fast processing like traffic monitoring.
Innovation Solution
The solution involves dispersing the circuits on two chips, with the photodiode on one chip and the pixel circuit, including N-type transistors and a current voltage conversion circuit, on another chip, to reduce the overall circuit scale and mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an address event detection circuit is arranged for each pixel in an asynchronous type solid-state imaging device, then fast image recognition processing capability is improved, but the circuit scale and mounting area increase
Solution Approach 1:
The pixel circuit is divided into two separate chips: the first chip contains only the photodiode for light detection, while the second chip contains the address event detection circuit. This segmentation allows the detection circuit to be shared among multiple photodiodes, reducing the mounting area per pixel while maintaining fast image recognition processing capability.
2Measurement precision
If the address event detection circuit is integrated with each pixel, then real-time light threshold detection is improved, but the device complexity increases
Solution Approach 1:
The address event detection circuit on the second chip serves multiple photodiodes simultaneously, making it a universal component that performs the same function for different pixels. This multi-functionality reduces overall device complexity while maintaining real-time light threshold detection accuracy through the shared circuit architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the mounting area of the solid-state imaging device while maintaining fast image recognition capabilities, improving safety in fields like traffic monitoring.
Implementation Method 1
a photodiode that photoelectrically converts incident light and generates a photocurrent
Data Source
AI summary
A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.