Addressable Test Chip Using Edge-Triggered Registers for High-Density DUT Testing

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Solution Overview

Problem

Existing addressable test chips face challenges with long test periods and low device density, which are not suitable for advanced technology nodes like 14 nm, 10 nm, or 7 nm, and require improvements in test efficiency and manufacturing area utilization.

Innovation Solution

A test system with an integrated address register, a new type of addressable test chip, and a probe card that supports high-density DUTs (>1000/mm2) by using edge-triggered flip-flop registers, counter logic, shifter logic, multiplexers, and selective addressing modules to enable efficient addressing modes such as binary, gray, and selective addressing, along with a multi-stage transmission gate switching circuit to reduce leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional short-ranged test chip is used, then each DUT needs to be connected to two or more pads achieving high test accuracy, but the area utilization rate is low

Engineering Contradiction:
Improvetest accuracyVSAvoidarea utilization rate
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent implements multi-functional pads that can serve multiple DUTs through time-division multiplexing. Each pad is configured to be shared among multiple DUTs by controlling the switching circuitry, allowing a single pad to perform multiple testing functions sequentially. This resolves the contradiction by enabling high area utilization while maintaining test accuracy through proper signal routing and timing control.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Quantity of substance

If addressable test chip uses decoders and switching circuit to share pads between DUTs, then the number of DUTs is increased, but the peripheral circuit becomes more complicated

Engineering Contradiction:
Improvenumber of DUTsVSAvoidperipheral circuit complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent segments the addressing function by dividing the address space into multiple regions, each region corresponding to a specific group of DUTs. This segmentation allows the peripheral circuit to be organized in a modular fashion, where each module handles a subset of DUTs. The switching circuit is accordingly divided into multiple controlled switches, each managed by a portion of the address decode logic, reducing the complexity of any single module while supporting a large total number of DUTs.

Inventive Principle:
Principle #1Segmentation

3Quantity of substance

If existing addressable test chip increases the number of DUTs, then the DUT density is improved, but the test cycle grows long

Engineering Contradiction:
ImproveDUT densityVSAvoidtest cycle
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The patent implements continuous testing by enabling the test apparatus to sequentially test multiple DUTs without interruption. The address register and switching circuit are coordinated to continuously cycle through the DUT array, allowing the test apparatus to maintain continuous operation. This continuous testing approach increases DUT density while managing test cycle time through efficient sequential access and parallel testing capabilities.

Inventive Principle:
Principle #20Continuity of useful action

4Reliability

If advanced technology nodes require high DUT density to improve failure detection rate, then the manufacturing area is reduced, but the test period becomes longer

Engineering Contradiction:
Improvefailure detection rateVSAvoidtest period
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent implements preliminary actions by pre-configuring the address register with address spaces that map to specific DUT regions before testing begins. The switching circuit is pre-programmed with the correspondence between address signals and DUT selections. This preliminary configuration allows the test apparatus to rapidly access and test DUTs in high-density arrangements without time-consuming setup procedures, thereby improving failure detection rates while managing test period lengths through efficient pre-established testing pathways.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11668748B2Addressable test chip
Publication Date: 2023.06.06 SEMITRONIX
  • US11668748B2 patent drawing
  • US11668748B2 patent drawing
  • US11668748B2 patent drawing

AI summary

A test apparatus for testing electrical parameters of a target chip includes: a function generator; a switch matrix module; a plurality of source measurement units (SMUs); at least one of the SMUs is configured to provide power supply for the target chip; at least one of the SMUs is coupled to the switch matrix module; and at least two of said SMUs are test SMUs coupled to ports of the target chip and the function generator.