Adhesion Substrate Conveyance With Pre-Alignment Collision Prevention
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Solution Overview
Problem
Existing substrate processing techniques face challenges in accurately aligning and separating pressing members from substrates due to misalignment and strong adhesive forces, leading to potential damage during conveyance and release processes.
Innovation Solution
A conveyance apparatus equipped with an acquisition unit to assess the state of adhesion substrates, a position adjusting unit to correct misalignments, and a conveyance unit to safely transport substrates without interference, using image acquisition devices and position adjusting mechanisms to ensure precise alignment and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate and pressing member are brought into contact to align centers, then alignment is achieved, but the centers may be misaligned causing collision damage during conveyance
Solution Approach 1:
The patent applies preliminary action by performing alignment verification before the conveyance process. The imaging device captures images of alignment marks on both the substrate and pressing member, and the control unit calculates positional relationships in advance to determine whether the centers are properly aligned. This preliminary check prevents collision damage during subsequent conveyance by identifying misalignment issues before they cause harm.
Solution Approach 2:
The patent implements feedback through an imaging device that captures images of alignment marks, and a control unit that processes these images to provide information about the positional relationship between the substrate and pressing member. This feedback mechanism enables real-time monitoring and adjustment of alignment, ensuring that centers are properly aligned before conveyance and preventing collision damage.
2Ease of operation
If a release force is applied to separate the pressing member from the substrate, then separation is achieved, but the release may fail due to large adhesive force
Solution Approach 1:
The patent introduces an imaging device and control unit as intermediaries between the substrate-pressing member system and the operator. These intermediaries capture images of alignment marks, process the images to determine positional relationships, and provide feedback information. This intermediary system enables precise monitoring of the alignment state, allowing for informed decisions about when to apply release force, thereby improving both the ease of operation and reliability of the release process.
3Device complexity
If the adhesion substrate is conveyed without position adjustment, then conveyance is simple, but the substrate may collide with the holding housing causing damage
Solution Approach 1:
The patent applies preliminary action by performing position verification before conveyance. The imaging device captures images of alignment marks on the substrate, and the control unit calculates the positional relationship in advance to determine whether the substrate is properly positioned. This preliminary check prevents collision damage during conveyance to the holding housing by identifying positioning issues before they cause harm.
Data Source
AI summary
A conveyance apparatus connected to a substrate processing apparatus configured to bring a pressing member and a material on a substrate into contact with each other to form a cured film of the material on the substrate, the conveyance apparatus includes an acquisition unit configured to acquire a state of a peripheral portion of an adhesion substrate including the pressing member and the substrate adhering to the pressing member with the material interposed in between, a position adjusting unit configured to adjust a position of the adhesion substrate based on a result acquired by the acquisition unit, and a conveyance unit configured to convey the adhesion substrate adjusted by the position adjusting unit.